1991
DOI: 10.1016/0167-9317(91)90151-3
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Laser cleaning of wafer surfaces and lithography masks

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Cited by 12 publications
(8 citation statements)
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“…Dans le cas de la décontamination nucléaire, le laser le plus utilisé est celui à fibres. Zapka et al (1991) ont décrit le mécanisme de cette décontamination. Sous les radiations laser, les particules vibrent ce qui diminue l'adhésion de la particule sur la surface.…”
Section: Laserunclassified
“…Dans le cas de la décontamination nucléaire, le laser le plus utilisé est celui à fibres. Zapka et al (1991) ont décrit le mécanisme de cette décontamination. Sous les radiations laser, les particules vibrent ce qui diminue l'adhésion de la particule sur la surface.…”
Section: Laserunclassified
“…5 We have investigated the laser cleaning process. However, it was observed that the 100 mJ/cm 2 KrF laser irradiation of Al or Cu particles on the stencil reticle leads to the particle melting and pattern deformation.…”
Section: Reticle Cleaningmentioning
confidence: 99%
“…The particles can obtain large acceleration and be ejected from the surface if this external force is larger than the adhesion force. [11][12][13][14][15] The temperature rise ⌬T of the top surface supporting particles is approximately given by 14…”
Section: Cleaning Mechanismsmentioning
confidence: 99%
“…Recently, laser cleaning was demonstrated to be a new technique to efficiently remove particulate and film contamination from substrate surfaces. [3][4][5][6][7][8][9][10][11] Compared with ultrasonic cleaning, it has several advantages as follows: ͑1͒ it is a dry process without using carbon fluorochloride and other organic solvents, which are harmful to human and environment; ͑2͒ it has high cleaning efficiency; ͑3͒ it is able to remove submicron particles from substrate surfaces; ͑4͒ it offers easy real-time in situ monitoring and area-selective cleaning.…”
Section: Introductionmentioning
confidence: 99%
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