Laser bonding of copper ribbons and clips on SiC power MOSFETs with sintered copper bond buffers

Pavlicek, Niko; Mohn, Fabian

doi:10.1109/estc48849.2020.9229724

Cited by 6 publications

(2 citation statements)

References 5 publications

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“…However, removing bond wires along with the modification in the metallization can significantly improve the thermal performance of the power module. Ribbon technology leads to an improvement in the power module by increasing its current capacity as demonstrated by Fraunhaufer in Germany [72] and Hitachi ABB Power Grids in Switzerland [73]. Tesla Model 3 also uses SiC modules produced by STMicroelectronics specially designed for improved thermal performance using copper clips connected to the terminal, specially manufactured die attach, and copper baseplate assembled on the pinfin heatsink [74], [75].…”

Section: B Bonding Techniquesmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technologies for the over-current performance of SiC power modules in power electronics converters. It presents the limitations produced at the power module level by packaging materials which include semiconductor chips, substrates, metallization, bonding techniques, die attach, and encapsulation materials. Specifically, technologies for over-current related temperatures in excess of 200 • C are discussed. The paper also discusses potential technologies which have been proven or may be potential candidates for improving the safe operating area. The discussed technologies are use of phase change materials below the semiconductor chip, Peltier elements, new layouts of the power modules, control and modulation techniques for converters. Special attention has been given to an overview of various potential phase change materials which can be considered for high-temperature operations.

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Section: B Bonding Techniquesmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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“…Further, emerging from the rapidly expanding e-mobility market, copper and thus the material-closed joining of copper with its excellent electrical and thermal conductivity, is becoming increasingly important [3]. Applications range from the microscale to the millimeter range for a wide variety of joint geometries, such as joints on power semiconductor modules [4] or high-current conductors (so-called "busbars").…”

Section: Introductionmentioning

confidence: 99%

Characterization of Vapor Capillary Geometry in Laser Beam Welding of Copper with 515 nm and 1030 nm Laser Beam Sources by Means of In Situ Synchrotron X-ray Imaging

Kaufmann

Forster

Hummel

et al. 2023

Metals

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Laser welding of copper is being used with increasing demand for contacting applications in electric components such as batteries, power electronics, and electric drives. With its local, non-contact energy input and high automation capability enabling reproducible weld quality, this joining technology represents a key enabler of future mobility systems. However, a major challenge in process design is the combination of energy efficiency and precise process guidance in terms of weld seam depth and defect prevention (i.e., spatter and melt ejections) due to the high electrical and thermal conductivity of copper. High-power lasers in the near infrared wavelength range (𝜆 ≈ 1 μm) and excellent beam quality provide an established joining solution for this purpose; nevertheless, the low absorptivity (≤5%) advocates novel beam sources at visible wavelengths due to altered absorptivity (40% at 515 nm) characteristics as an improved tool. In order to understand the influence of laser wavelength and process parameters on the vapor capillary geometry, in situ synchrotron investigations on Cu-ETP with 515 nm and 1030 nm laser sources with the same spot diameter are compared. The material phase contrast analysis was successfully used to distinguish keyhole and melt pool phase boundaries during the welding process. A significantly different sensitivity of the keyhole depth in relation to the feed rate was found, which is increased for the infrared laser. This behavior could be attributed to the increased effect of multiple reflections at 1030 nm.

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Laser Applications in Ceramic and Metal Joining: A Review

Zhao,

Janasekaran,

Fong

et al. 2024

Met. Mater. Int.

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Laser bonding of copper ribbons and clips on SiC power MOSFETs with sintered copper bond buffers

Cited by 6 publications

References 5 publications

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Characterization of Vapor Capillary Geometry in Laser Beam Welding of Copper with 515 nm and 1030 nm Laser Beam Sources by Means of In Situ Synchrotron X-ray Imaging

Laser Applications in Ceramic and Metal Joining: A Review

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