2005
DOI: 10.1007/s00542-005-0588-3
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Laser bending for adjusting curvatures of hard disk suspensions

Abstract: The purpose of this work is to use 3D finite element analyses to compute bending of a hard disk suspension using a laser. The pitch and roll of the suspension can be precisely adjusted by producing a controlled amount of residual strain using the laser as a heat source. In the computational model, an uncoupled thermo-mechanical analysis is applied to calculate the laser induced thermal loading and mechanical deformation. The relation between suspension bending and laser parameters is studied based on extensive… Show more

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Cited by 13 publications
(8 citation statements)
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References 12 publications
(19 reference statements)
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“…The technique which uses soft cushion between the wafer and the chuck to bend the wafer for topography compensation was already reported (9). Another approach is the use of liquid with similar refractive index to SU-8 between the mask and the wafer to compensate the air gap (10).…”
Section: Methodsmentioning
confidence: 99%
“…The technique which uses soft cushion between the wafer and the chuck to bend the wafer for topography compensation was already reported (9). Another approach is the use of liquid with similar refractive index to SU-8 between the mask and the wafer to compensate the air gap (10).…”
Section: Methodsmentioning
confidence: 99%
“…The laser was utilized to adjust the static pitch and roll while the polynomial regression model is used to estimate the numbers of laser beam projections [6]. Reference [7] proposed the use of 3D finite element analysis to compute bending of suspension using laser. This paper focused on adjusting the pitch and roll of suspension.…”
Section: Gram Load Adjust Process and Key Process Input Variablesmentioning
confidence: 99%
“…The development of the LPF process can enable die-free design flexibility, production of complex shapes, thick plate forming, and spatial forming of a sheet metal component [6,7]. For instance, a laser peen micro-bending method has been applied to accurately adjust micro-components for micro-electro-mechanical system [8][9][10][11] or optical devices [12].…”
Section: Introductionmentioning
confidence: 99%