2021
DOI: 10.1364/ome.417871
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Laser-assisted etching of borosilicate glass in potassium hydroxide

Abstract: We present a method for the selective etching of borosilicate glass (SCHOTT Borofloat 33), in which we modify the glass with an ultrashort pulse laser and subsequent wet chemical etching. The BF33 glass is often used in microtechnology to produce sensors, actors, and fluidic chips as it can be bonded to silicon wafers by anodic bonding. The glass is irradiated and modified by circular polarized laser light with a wavelength of 1030 nm. By etching the glass with potassium hydroxide, the modified material can be… Show more

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Cited by 15 publications
(14 citation statements)
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“…In a subsequent etching step, uniform removal of the unmodified covers at both surfaces occurs before the increased etching rate of the laser modified glass [36] leads to a separation when the etching radius exceeds the modification pitch at each depth within the sample. Figure 13 shows the symmetric edge that is produced with this revised processing strategy and the shifted focal line.…”
Section: Separation Resultsmentioning
confidence: 99%
“…In a subsequent etching step, uniform removal of the unmodified covers at both surfaces occurs before the increased etching rate of the laser modified glass [36] leads to a separation when the etching radius exceeds the modification pitch at each depth within the sample. Figure 13 shows the symmetric edge that is produced with this revised processing strategy and the shifted focal line.…”
Section: Separation Resultsmentioning
confidence: 99%
“…[14][15][16] ULISE generally involves local laser modification of glass followed by chemical treatment with hydrofluoric acid (HF) or potassium hydroxide (KOH) to preferentially etch away the laser modified regions (LMRs) due to the much higher etching rate than nonmodified regions. [17][18][19][20] ULISE thus enables fabrication of high-quality, high-aspect-ratio holes in glass substrates. In the present study, we propose a scheme to demonstrate an efficient method of writing 20 000 micro-through-holes (MTHs) in a glass slide by ULISE using a Bessel beam for the purpose of digital NAAT.…”
Section: Introductionmentioning
confidence: 99%
“…1,2 The process is based on two steps: first the glass substrate is selectively exposed to ultrashort pulsed laser radiation and subsequently the modified material is etched away in potassium hydroxide (KOH), leaving the desired 3D glass structure. 3,4 Although well developed, SLE is used in fabrication of 3D glass microfluidic devices and micro channels, 5 but not for optical components due to its residual rough surface. 6,7 Smoothening methods using controlled laser surface-heat treatment have been developed to improve the surface quality and have achieved promising results.…”
Section: Introductionmentioning
confidence: 99%