1997
DOI: 10.1109/3.631270
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Laser ablation and micromachining with ultrashort laser pulses

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Cited by 880 publications
(483 citation statements)
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“…However, the heat absorbed at the focal point is sufficient to generate radial microcracks from the hoop stresses associated with thermal expansion (Fig. 2b) [41][42][43] . These cracks only propagate over short distances, because the hoop stresses decrease rapidly away from the focal point.…”
Section: Resultsmentioning
confidence: 99%
“…However, the heat absorbed at the focal point is sufficient to generate radial microcracks from the hoop stresses associated with thermal expansion (Fig. 2b) [41][42][43] . These cracks only propagate over short distances, because the hoop stresses decrease rapidly away from the focal point.…”
Section: Resultsmentioning
confidence: 99%
“…Nanoplasmonics has not been considered in conventional models of dielectric breakdown with short [4] or ultrashort [5] pulses-nanostructures are hard to observe inside dielectrics and plasmas are hard to diagnose. We observe the nanostructures by cutting or grinding the dielectric to the modified zone and polishing and etching the surface before imaging it with an atomic force microscope (AFM) [6] or a scanning electron microscope (SEM).…”
mentioning
confidence: 99%
“…Ces mecanismes sont tres complexes puisqu'ils dependent, a la fois des caracteristiques de la source laser ( fluence, longueur d'onde, profil spatio-temporel de Pimpulsion, taux de repetition) et des proprietes optiques et thermiques du materiau considere, qui peuvent evoluer considerablement au cours de l'irradiation a cause des effets thermiques, de phenomenes de transitions de phase, ou encore de reactions chimiques. Quelque soit la nature du materiau considere (dielectrique, semiconducteur, metal), les etudes recentes [3][4][5][6][7] montrent le role particulierement important joue par la duree de l'impulsion laser sur le phenomene d'ablation, pour trois raisons : (i) Les intensites extremement elevees emises par les sources a impulsions ultra-courtes ( I ~ 10 14 -10 15 W/cm 2 ), favorisent les processus d'absorption multiphotoniques. (ii) En regime femtoseconde, l'impulsion laser n'interagit plus avec le plasma qui se forme apres l'extinction de la source d'excitation.…”
Section: Interaction Laser-matiere Et Formation Du Plasmaunclassified