Large stroke actuation of continuous membrane for adaptive optics by 3D self-assembled microplates

Quévy, E.; Bigotte, P.; Collard, Dominique; Buchaillot, L.

doi:10.1016/s0924-4247(01)00735-x

Cited by 15 publications

(7 citation statements)

References 25 publications

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“…3,4 Thus far, the main drawback limiting the use of Ta lies in the relatively high residual stress existing in sputtered thin-films, which causes adhesion issues and electrical resistivity variations. 8,9 Furthermore, out-of-plane structures can be envisioned for implementing novel devices with innovative functionalities such as vibrating 3D MEMS. 5,6 Although few groups have investigated the influence of oxygen and thermal cycling on the evolution of stress in Ta films, studies on the effect of sputtering conditions on the films' residual stress are not readily available in literature.…”

Section: Introductionmentioning

confidence: 99%

Control of stress in tantalum thin films for the fabrication of 3D MEMS structures

Mastropaolo

Latif

Grady

et al. 2013

Journal of Vacuum Science & Technology B, Nanotechnology an

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Effect of oxygen on the thermomechanical behavior of tantalum thin films during the β -α phase transformation Accuracy of thin film stress measurements with c -Si microbeams fabricated by dry etching Sputtered tantalum (Ta) thin-films subjected to high compressive stress have been used for fabricating out-of-plane microelectromechanical systems (MEMS) clamped-clamped beams. The as-deposited film stress has been investigated as a function of sputtering conditions (pressure and power) in order to determine the optimal deposition parameters for achieving a compressive state. A variation of the as-deposited film stress has been observed as a function of time at atmospheric conditions and reduced by $85% using annealing in oxygen atmosphere at 100 C. By surface-micromachining Ta thin-films deposited in compressive state (beyond the critical buckling load), buckled out-of-plane beams have been fabricated with lengths in the range of 500 lmÀ5.8 mm and central out-of-plane deflection up to $60 lm. A final stress of $À850 MPa has been calculated from the measured beams' deflection. The modal behavior of the buckled out-of-plane beams has been investigated with optical measurements and finite element simulations. The large curvature and high residual stress experienced by the beams have shown to affect the usual order of consecutive bending mode shapes. The devices presented can be utilized for implementing cutting-edge three-dimensional MEMS.

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Section: Introductionmentioning

confidence: 99%

Control of stress in tantalum thin films for the fabrication of 3D MEMS structures

Mastropaolo

Latif

Grady

et al. 2013

Journal of Vacuum Science & Technology B, Nanotechnology an

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“…Recently, just as important as its negative factor, buckling related research is increasingly beneficial to advancements of the tricky design and novel actuation mechanism in the microelectromechanical system (MEMS). Described as a rapid transition between two stable states, snap-through buckling is suitable for many MEMS applications, including micromirrors [2], latch-lockers [3], micro-mechanical memory with onchip readout [4], energy harvesting [5], microactuators 4 Author to whom any correspondence should be addressed. [6][7][8], and microswitches [9,10].…”

Section: Introductionmentioning

confidence: 99%

The influences of transverse loads on electrothermal post-buckling microbeams

Chen

Zheng

et al. 2011

J. Micromech. Microeng.

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We report on a nonlinear equation-based closed-form solution for a spring-loading-enclosed electrothermal post-buckling microbeam that expresses (a) the relation between the compressive loads and its corresponding lateral deflections and (b) the threshold loads required to trigger the buckling phenomenon, under the condition of a variety of transverse loads. Our theoretical research reveals that the post-buckling behavior varies considerably under different transverse load ranges. Three types of double-clamped microbeams connected to microsprings with different dimensions and compliances representing transverse loads were fabricated and measured using microelectromechanical systems (MEMS) technology. Excellent agreement was found between our theoretical analysis and experimental results to confirm our exact solutions. It proves that the influences on thermal post-buckling behavior are dependent on different microbeam dimensions and microspring compliances (i.e., transverse loads). Therefore, an electrothermal buckling/post-buckling beam under external transverse loads can be accurately predicted using our theoretical model, which can be applied to either existing microdevices that are based on similar principles or other potential applications.

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“…As a consequence of the popularity and utility of electrostatic MEMS, many aspects of effects subject to electrostatic forces in MEMS devices have been investigated in recent years. Researchers have studied the pull-in instability [ 17 - 20 ], characteristics of the displacement during actuation [ 16 , 21 - 23 ], shape and location of electrodes [ 24 - 26 ], dynamic response and optimization of the electrostatic force [ 9 , 27 ], nonlinear dynamics, chaos and bifurcation of the electrostatically actuated systems and analysis methods (FEM, FDM and FCM, etc.) for evaluating the nonlinear electrostatic forces [ 28 - 32 ], simulation software and systems (ANSYS, ABAQUS, COULOMB, MEMCAD system and Macromodel, etc.)…”

Section: Introductionmentioning

confidence: 99%

Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

Zhang

Meng

Chen

2007

Sensors

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Electrostatic micro-electro-mechanical system (MEMS) is a special branch with a wide range of applications in sensing and actuating devices in MEMS. This paper provides a survey and analysis of the electrostatic force of importance in MEMS, its physical model, scaling effect, stability, nonlinearity and reliability in detail. It is necessary to understand the effects of electrostatic forces in MEMS and then many phenomena of practical importance, such as pull-in instability and the effects of effective stiffness, dielectric charging, stress gradient, temperature on the pull-in voltage, nonlinear dynamic effects and reliability due to electrostatic forces occurred in MEMS can be explained scientifically, and consequently the great potential of MEMS technology could be explored effectively and utilized optimally. A simplified parallel-plate capacitor model is proposed to investigate the resonance response, inherent nonlinearity, stiffness softened effect and coupled nonlinear effect of the typical electrostatically actuated MEMS devices. Many failure modes and mechanisms and various methods and techniques, including materials selection, reasonable design and extending the controllable travel range used to analyze and reduce the failures are discussed in the electrostatically actuated MEMS devices. Numerical simulations and discussions indicate that the effects of instability, nonlinear characteristics and reliability subjected to electrostatic forces cannot be ignored and are in need of further investigation.

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Large stroke actuation of continuous membrane for adaptive optics by 3D self-assembled microplates

Cited by 15 publications

References 25 publications

Control of stress in tantalum thin films for the fabrication of 3D MEMS structures

Control of stress in tantalum thin films for the fabrication of 3D MEMS structures

The influences of transverse loads on electrothermal post-buckling microbeams

Stability, Nonlinearity and Reliability of Electrostatically Actuated MEMS Devices

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