1993
DOI: 10.1143/jjap.32.l1635
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Large-Area Electron Cyclotron Resonance Plasma Source with Permanent Magnets

Abstract: A large-area electron cyclotron resonance (ECR) plasma is generated by using permanent magnets and applying the whistler-mode launching of microwaves. A uniform plasma is produced with the uniformity of ±3.5% over 20 cm and ±1.8% over 16 cm in diameter; the plasma space potential is about 17 V with the uniformity of ±1% over 20 cm. The maximum ion current density is about 11.5 mA·cm-2. The purity of the produced plasma is high. No damage was found after the operation for 100 h with the microwave power of 600 W. Show more

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Cited by 21 publications
(11 citation statements)
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“…From Langmuir probe diagnostics of pure Ar gas in this region, T e and the plasma density (n e ) were approximately 3 eV and 1.0 ϫ 10 11 cm Ϫ3 , respectively. 4 The gradient and curvature of the permanent magnet magnetic field provide particle drift and diffusion in the downstream region that produces a uniform and a low temperature plasma. It has been shown in a previous report that such low T e values produce low energy controlled dissociation kinetics compared to conventional electromagnet ECR plasma sources.…”
Section: Methodsmentioning
confidence: 99%
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“…From Langmuir probe diagnostics of pure Ar gas in this region, T e and the plasma density (n e ) were approximately 3 eV and 1.0 ϫ 10 11 cm Ϫ3 , respectively. 4 The gradient and curvature of the permanent magnet magnetic field provide particle drift and diffusion in the downstream region that produces a uniform and a low temperature plasma. It has been shown in a previous report that such low T e values produce low energy controlled dissociation kinetics compared to conventional electromagnet ECR plasma sources.…”
Section: Methodsmentioning
confidence: 99%
“…In achieving such a low pressure etch process, a wide variety of high density plasma sources are being employed. [1][2][3][4] Etch selectivity is determined by the plasma chemistry and plasma-material interaction processes, hence understanding the plasma chemistry and the kinetics involved is vital for achieving the required selectivity. For the selective etching of silicon dioxide ͑SiO 2 ) over silicon ͑Si͒, a wide range of complex chemistries using various feed gases such as CHF 3 , CF 4 , C 2 F 6 , and C 4 F 8 have been employed 3,5-11 both with and without additions of Ar, H 2 and O 2 .…”
Section: Introductionmentioning
confidence: 99%
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“…In discharges in the microwave frequency range, the use of cyclotron resonance of electrons with radiated fields from a slotted planar antenna has produced uniform plasmas of densities ranging from 10 10 to 10 11 cm −3 at pressures in the mTorr range. [1][2][3] The magnetic field necessary for resonant interaction is produced by an array of permanent magnets in this type of plasma source.…”
Section: Introductionmentioning
confidence: 99%