Kinetics of sublimation of copper(II) acetylacetonate complex used for chemical vapor deposition of copper films

Pauleau, Y.; Fasasi, A.Y.

doi:10.1021/cm00013a015

Cited by 57 publications

(36 citation statements)

References 1 publication

(1 reference statement)

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“…From this plot, the A H of the phase transitions was obtained (Table 4 ) . The values of AH are in the range of 90-150 kJ/mol which are similar to those obtained from the literature [31] [32]. Temperature range of the weight-loss measurements.…”

Section: Metal-organic Chemical Vapor Deposition (Mocvd) Is An Establsupporting

confidence: 84%

Synthesis, Crystal Structure, and Thermal Behaviour of Some New Copper Complexes with tridentate β‐iminoketone ligands

Becht

Gerfin

Dahmen

1994

Helvetica Chimica Acta

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Section: Metal-organic Chemical Vapor Deposition (Mocvd) Is An Establsupporting

confidence: 84%

Synthesis, Crystal Structure, and Thermal Behaviour of Some New Copper Complexes with tridentate β‐iminoketone ligands

Becht

Gerfin

Dahmen

1994

Helvetica Chimica Acta

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“…In the article [63] the table of known copper precursors for CVD is presented. Among the all precursors both copper I chloride and copper II chloride are listed.…”

Section: Methodsmentioning

confidence: 99%

Formation of copper porous structures under near-equilibrium chemical vapor deposition

Kornyushchenko

Natalich

Perekrestov

2016

Journal of Crystal Growth

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a b s t r a c tThe mechanism of copper structure formation under near-equilibrium conditions in a chemically-active medium-condensate system has been investigated. The desired conditions have been implemented using CVD system. Copper chloride CuCl 2 was used as a source material, and mixture of hydrogen with nitrogen served as a working gas. The influence of the evaporation temperature, condensation temperature and state of the growth surface on the porous structures formation has been investigated. It has been established, that the structure formation mechanism is determined by layer-by-layer or normal crystal growth, nucleation and growth of whiskers, and also by partial intergrowth of structural elements.

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“…It was successfully used to deposit copper thin films on planar substrates such as borosilicate glass [22], silicon [23,24], Kapton polymer [25] and metals (Al, Ni and Pd) [26]. At atmospheric pressure, pure copper was obtained between 220 and 400°C under pure hydrogen or using N 2 /H 2 or Ar/H 2 mixtures with H 2 concentrations higher than 50 vol% [22,23,26]. To the best of our knowledge, Cu(acac) 2 has never been used to deposit copper on nanotubes.…”

Section: ·Kmentioning

confidence: 99%

“…Indeed, carbon nanotube walls are rather unreactive due to the seamless arrangement of hexagonal carbon rings without any dangling bond [23]. Experimental observations have clearly shown that the intrinsic surface defects play an important role in the adsorption of atoms on MWCNTs.…”

Section: ·Kmentioning

confidence: 99%

Fluidized bed chemical vapor deposition of copper nanoparticles on multi-walled carbon nanotubes

Lassègue

Noé

Monthioux

et al. 2017

Surface and Coatings Technology

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OATAO is an open access repository that collects the work of Toulouse researchers and makes it freely available over the web where possible. A B S T R A C TMulti-walled carbon nanotubes tangled in easy-to-fluidize porous balls have been decorated by pure copper nanoparticles using a pre-industrial fluidized bed chemical vapor deposition process. Copper (II) acetylacetonate Cu(acac) 2 was used as precursor. The low precursor volatility led to low deposition rates, responsible for a nonuniformity of the deposit both on the MWCNT balls and from the outer part to the center of the balls. An oxidative pre-treatment of the MWCNTs allowed to increase slightly the deposit weight and uniformity, by creating new nucleation sites on the nanotube surface. It also allowed decreasing the size of Cu nanoparticles by a factor of ten. A decrease of the deposition temperature increased more markedly the deposit weight, by probably favoring the formation of gaseous reactive intermediate species more reactive on the oxidized nanotube surface. A more efficient precursor delivery system would allow reaching higher deposition rates and much more uniform deposits, making possible an industrial production of metallized carbon nanotubes.

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Kinetics of sublimation of copper(II) acetylacetonate complex used for chemical vapor deposition of copper films

Cited by 57 publications

References 1 publication

Synthesis, Crystal Structure, and Thermal Behaviour of Some New Copper Complexes with tridentate β‐iminoketone ligands

Synthesis, Crystal Structure, and Thermal Behaviour of Some New Copper Complexes with tridentate β‐iminoketone ligands

Formation of copper porous structures under near-equilibrium chemical vapor deposition

Fluidized bed chemical vapor deposition of copper nanoparticles on multi-walled carbon nanotubes

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