Kinetics of nickel and nickel stannide solution in liquid tin

Interfacial interaction of solid nickel with liquid bismuth and Bi–base alloys

“…Such low solubility values, 0.00005 to 0.094% in the 150-450 • C temperature range, of nickel in the alloy could hardly be expected judging from the solubility values in binary systems of nickel with the main alloy constituents bismuth (for example, at 300 • C c s = 0.32% Ni) and tin (c s = 0.26% Ni at that temperature [6]). In view of their relatively low content, the influence of indium and zinc cannot be significant.…”

“…Usually, for liquid-metal melts Sc < 1000. In such a case, a more accurate value of D can be obtained by using the Kassner equation [11]: (6) in which the factor I is a function of the Schmidt number: I = f(Sc). This equation is valid for Sc > 4.…”

Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

“…Such a large drop could not be expected judging from the solubility values in binary systems of nickel with the main alloy constituents tin and bismuth. For example, at 350 o C c s is 0.43% Ni for tin [12] and 0.39% Ni for bismuth [13]. In view of their relatively low content in the alloys, the influence of indium, zinc and antimony can hardly be significant.…”

“…Note that relatively small amounts of additives produce a very considerable effect on the solubility of nickel in Sn-base soldering alloys. The temperature dependence of the nickel solubility in pure tin at 300-700 o C is reported to obey the equation [12] c s = 5.34 × 10 2 exp (-36900/RT) %.…”

“…It means that, in spite of the great difference in solubility values, the rates, with which those are attained, are not so different. Although the former may differ by a few orders of magnitude, the latter usually fall in the range (1-10) × 10 -5 m s -1 at reasonable rates of agitation of the liquid [11][12][13][14]. …”