Kinetics of intermetallic phase formation at the interface of Sn–Ag–Cu–X (X = Bi, In) solders with Cu substrate

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

“…Additionally, Bi additions have been shown to improve wetting and spreading of lead-free solders [27,29,33] and to lower their liquidus temperature [34]. Furthermore, Bi additions to SAC solders hinder the growth rate of the Cu3Sn interfacial IMC layer [29,35,36] and to reduce the propensity to whisker growth [37,38].…”

Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In

“…The melting point of eutectic composition is relatively high (227 • C) when compared to the Sn-Pb (183 • C) [8]. Nevertheless, there has been only a limited amount of data about the mechanical properties of Sn-Cu solder and its joint [9,10].…”

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

“…As final remarks on the effects of Bi, we point out that addition of Bi to Sn-Ag-Cu solder has been observed to decrease the thickness and growth rate of the Cu 6 Sn 5 intermetallic layers when soldered on Cu pads 45 and to suppress the formation of the Cu 3 Sn intermetallic layer. 46 Other recognized effects of Bi as an alloying element in solders are related to its ability to effectively mitigate tin whisker growth 47 and to contribute to improvement in the wetting ability of copper surfaces. [48][49][50] …”