2015 16th International Conference on Electronic Packaging Technology (ICEPT) 2015
DOI: 10.1109/icept.2015.7236622
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Kinetics of interfacial reaction between Sn-3.0Ag-0.5Cu solder and Co-4.0P or Co-8.0P metallization

Di Yang
1
,
Guoshuai Yang
2
,
Jian Cai
3
et al.
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