Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system

A Comparative Study on the Influence of SAC305 Lead‐Free Solder Sandwiched by Sn on the Micromechanical and Electrical Properties of the Joints

“…Among various lead‐free solder alternatives studied during the past decade Sn–3.0Ag–0.5Cu (SAC305) solder alloy has been found as one of the most widely used lead‐free solder material. [ 1 ] However, its use in electronic gadgets manufacturing essentially spot many challenges like higher processing temperature, premature failure, higher intermetallic compound (IMC) layer growth at the interface and the higher electrical resistance of the interconnects. These serious challenges demand immediate attention from the scientists to develop further suitable lead‐free solders.…”

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

“…In an electronic packaging system, solder joints provide an electrical connection and mechanical support to the electronic components. The need for function integration, high power, and density of the electronic products has been a driving force for highly reliable inter-connection solder joints [1,2]. Because of the inherent toxicity of lead, the use of SnPb solder has been restricted.…”