Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections

López, G.A.; Sommadossi, S.; Zięba, P.; Gust, W.; Mittemeijer, E. J.

doi:10.1016/s0254-0584(02)00232-8

Cited by 46 publications

(51 citation statements)

References 11 publications

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“…In the research by diffusion-soldered Ni/Al/Ni interconnections [1] , the growth of the Ni 3 Al phase also obeyed the parabolic rate law. Thus, it is expected that all the intermediate phases in the Ni-Al system can grow according to the parabolic law, however, there is an exceptional example, indicating that the Ni 2 Al 3 phase obeyed the parabolic rate law, but the NiAl 3 phase didn't grow according to this law [2] .…”

Section: Introductionmentioning

confidence: 83%

“…The concentration of the Al element of the narrow and broad phase layers in Fig.1 are 73.630 at% and 57.010 at% by the quantitative analysis using the EPMA across the joint, respectively. According to the binary phase diagram of Ni-Al system [1] , these two product layers are the NiAl 3 (close to Al) and Ni 2 Al 3 (close to Ni) phases, respectively.…”

Section: Diffusion Couple Specimensmentioning

confidence: 99%

“…Further formation and growth of NiAl 3 requires a continuous supply of Ni atoms from the Ni substrate through the Ni 2 Al 3 layer. As a large part of diffusing atoms was exhausted for the formation and growth of the Ni 2 Al 3 layer, this may caused a deficiency of Ni atoms for the growth of NiAl 3 layer [4] , and thus the thickness of the NiAl 3 layer was much smaller than that of the Ni 2 Al 3 layer. The initial thicknesses of the NiAl 3 and Ni 2 Al 3 layers were 1.2 µm and 4.5 µm on average, respectively.…”

Section: Identification and Characterization Of The Initial Product Lmentioning

confidence: 99%

“…Because of the complex of the phase diagram of Ni-Al system, the reactive diffusion has been extensively studied with various techniques of diffusion couple [1][2][3][4][5] . The numerous investigations have focused on type, sequence, nucleation-and-growth process and mechanism of phase transformations.…”

Section: Introductionmentioning

confidence: 99%

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Formation and growth kinetics of intermediate phases in Ni-Al diffusion couples

Ren

Zhou

et al. 2009

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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Formation and growth of the intermediate phases in the Ni-Al diffusion couples prepared by pouring technique were investigated. Electron probe microanalysis, scanning electron microscopy and X-ray diffraction were used to characterize the product phases in the joints. The results show that two intermediate phases form in the sequence of NiAl 3 and Ni 2 Al 3 during solidification. After annealed, Ni 2 Al 3 and NiAl 3 still exist in the joints of the couples. The reasons for the formation of Ni 2 Al 3 and NiAl 3 , as well as the absence of NiAl, Ni 5 Al 3 and Ni 3 Al were discussed, respectively. The growth kinetics of both product phase layers indicates that their growth obeys the parabolic rate law. The activation energies and frequency factors for NiAl 3 and Ni 2 Al 3 phases were also calculated according to the Arrhenius equation.

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Section: Introductionmentioning

confidence: 83%

Section: Diffusion Couple Specimensmentioning

confidence: 99%

Section: Identification and Characterization Of The Initial Product Lmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Formation and growth kinetics of intermediate phases in Ni-Al diffusion couples

Ren

Zhou

et al. 2009

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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“…[7,8] Usually the whole liquid is consumed to create the first intermetallic phase but there are exceptions (Ni/Al/Ni system) where two intermetallics can coexist with unconsumed liquid phase. [9,10] The interconnection obtained after diffusion soldering possesses thermal and mechanical properties of the intermetallic phases present in the joint. After the termination of the process the joint consists exclusively of intermetallic phases.…”

mentioning

confidence: 99%

The Effect of Intermetallic Compound on Shear Strength of Diffusion Soldered Interconnection

2006

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Since lead-tin solders have been acknowledged as the strongly harmful to men's life and environment, both new solders and attractive joining technologies are searched. [1][2][3][4] There are several important bonding method issues that have to be considered when talking about Pb-free solders, among them their thermal and mechanical stability, wetting characteristics, availability, non-toxicity and cost.Recently, diffusion soldering has been shown as a good candidate to fulfill these demands and homogeneous joints maybe produced. [5,6] This straightforward method bases on four stages: heating, dissolution, isothermal solidification and growth of intermetallic phases. Solder is usually introduced as a thin foil clamped between two high melting metal bars under a low pressure and heated up to the joining temperature, which is slightly above the foil melting point. During first stage -heating, diffusion between substrates and the foil takes place. At the second stage -dissolution occurs along with the temperature increase up to the joining temperature. High melting (HM) element is dissolved in the liquid low melting (LM) component. Further annealing leads to the third stage called isothermal solidification controlled by the diffusion of liquid element to solid substrate. At the liquid/solid interface the concentration of solder become fixed as the local equilibrium is assumed. In this way, the thickness of the liquid area shrinks gradually until the whole LM is consumed and the first intermetallic phase (IP) appears in the interconnection zone. It grows during the last period called growth of the intermetallic phases. Sequence of IPs appearance can be predicted looking at the appropriate equilibrium phase diagram of the LM and HM components. [7,8] Usually the whole liquid is consumed to create the first intermetallic phase but there are exceptions (Ni/Al/Ni system) where two intermetallics can coexist with unconsumed liquid phase. [9,10] The interconnection obtained after diffusion soldering possesses thermal and mechanical properties of the intermetallic phases present in the joint. After the termination of the process the joint consists exclusively of intermetallic phases. On the contrary, the conventional soldering results only in the thin layer of intermetallics adjacent to the base material. The rest of the joint area is occupied by the solder.Under normal service conditions the elements are endanger on high temperature. The differences in thermal expansion between the components are the source of shear loading. Therefore, the testing of mechanical properties should be one of major type of joint investigation. This work is focused on In-48 at%. Sn interconnection produced by diffusion soldering in temperature range of 200-300°C. The choice of the applied solder was dictated by low melting temperature of the eutectic alloy (118°C). In order to form intermetallic phases and investigate their influence on mechanical properties of the joint various temperatures and different times of annealing were selected.Results ...

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Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer

Wang

Cao

2019

Adv Eng Mater

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In this work, the interface of a CuW/Al composite with and without a nickel (Ni) interlayer during solid‐state diffusion bonding is investigated. The effects of different intermetallic compounds (IMCs) forms at the interface on the microstructure and mechanical properties are analyzed. Electroless deposition of a Ni interlayer onto the surface of CuW effectively inhibits the formation of the Al2Cu phase and the thickness of the IMCs layer is greatly decreased. Meanwhile, the type of IMCs is changed, and the indentation hardness is slightly reduced. Compared with the CuW/Al composites without Ni interlayer, the CuW/Al composites with Ni interlayer provide a desirable ≈50% increase in the shear strength, which can reach 30 MPa at 550 °C. Additionally, the interface with Ni interlayer mainly consists of Al3Ni2 and Al3Ni, and the first‐principles calculation shows that Al3Ni2 exhibits a structural stability superior to Al3Ni. Experimental and calculation results consistently indicate that Al3Ni2 forms first because of the low formation enthalpy.

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Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections

Cited by 46 publications

References 11 publications

Formation and growth kinetics of intermediate phases in Ni-Al diffusion couples

Formation and growth kinetics of intermediate phases in Ni-Al diffusion couples

The Effect of Intermetallic Compound on Shear Strength of Diffusion Soldered Interconnection

Microstructural Evolution and Mechanical Properties of Intermetallics at the CuW/Al Interface with a Ni Interlayer

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