Kinetic analysis of organosilane hydrolysis and condensation

Torry, S.A.; Campbell, Andrew D.; Cûnliffe, A.V.; Tod, D.A.

doi:10.1016/j.ijadhadh.2005.03.008

Cited by 56 publications

(55 citation statements)

References 12 publications

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“…Figure 3 shows the 1 H-NMR spectrum of HPS (ppm): 2.6 (a), 2.79 (b), 3.18 (c), 3.67 (d), 3.32 (e), 3.48 (f), 1.62 (g), 3.52 (k), 0.67 (i), 7.12-7.66 (j) [15]. Experiments show that the chemical shifts match those of the chemical structure of the desired product.…”

Section: Resultsmentioning

confidence: 99%

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

Liu

Xiao

Deng

et al. 2014

J Therm Anal Calorim

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A novel polysiloxane (HPS) with epoxy and phenyl groups was synthesized by controlled hydrolysis and condensation of c-(2,3-epoxypropoxy)propytrimethoxysilane (KH560) and diphenyl silanediol. Besides, HPS was used as the compatibilizer of the miscible diglycidyl ether of bisphenol A (DGEBA)/methyl phenyl silicone resin (Si603) blend. The structure and effect of HPS were characterized by Fourier transform infrared spectra, nuclear magnetic resonance ( 1 H-NMR), differential scanning calorimetry, and scanning electron microscopy (SEM). The results showed that HPS could significantly improve the compatibility between epoxy resin (EP) and Si603 resin. In addition, the glass transition temperature (T g ) of the blend increases with increasing amount of Si603 from 129 to 151°C. The thermal stability of blending system was studied by thermogravimetric analysis, derivative thermogravimetric analysis and SEM. The results showed that the incorporation of Si603 into DGEBA resin not only obviously increased the thermal resistance, but also remarkably improved the flame retardancy. The high limiting oxygen index of the HPS/EP/Si603/DDM system at 31 is considered as excellent flame retardancy in the epoxy system.

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Section: Resultsmentioning

confidence: 99%

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

Liu

Xiao

Deng

et al. 2014

J Therm Anal Calorim

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“…44.6 (epoxy ring, -CH 2 -), 50.9 (epoxy ring, -CH-), 70.9 (-O-CH 2 -epoxy ring), 74.5 (-CH 2 -CH 2 -O-). 29 Si …”

Section: Equipment and Analytical Measurementsmentioning

confidence: 99%

“…In such cases, curing occurs through hydrolysis of alkoxy groups followed by condensation of hydroxyl groups. [44] …”

Section: -73mentioning

confidence: 99%

“…The peak at higher field may be assigned to structural species Q 4 [Si(OSi) 4 ] and corresponds to a silicon atom attached to four silicon species via oxygen bridges. [44,45] Similarly, the peak at lower field may be assigned to structural species M 1 [Si(OSi)H(CH 3 ) 2 ] and corresponds to a silicon atom attached to one silicon atom via an oxygen bridge. [44,45] Therefore, it may be concluded that the G 0 A dendrimer synthesized successfully.…”

Section: Nmr Studiesmentioning

confidence: 99%

“…[44,45] Similarly, the peak at lower field may be assigned to structural species M 1 [Si(OSi)H(CH 3 ) 2 ] and corresponds to a silicon atom attached to one silicon atom via an oxygen bridge. [44,45] Therefore, it may be concluded that the G 0 A dendrimer synthesized successfully.…”

Section: Nmr Studiesmentioning

confidence: 99%

See 2 more Smart Citations

Studies on the synthesis and thermal properties of alkoxysilane‐terminated organosilicone dendrimers

Saxena

Bisaria

Saxena

2010

Applied Organom Chemis

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Silicone core dendrimers bearing terminal dialkoxy and trialkoxy silane groups were prepared in a three-step synthesis. Initially, the Si-H terminated multifunctional silicone dendrimer, i.e. tetrakis(dimethylsiloxy)silane, was prepared by the reaction of tetraethoxysilane and dimethylethoxysilane. Tetrakis(dimethylsiloxy)silane on reaction with allylglycidylether in the presence of Speier's catalyst under pressure (100 psi) yielded epoxy-terminated dendrimer in very high yield (95%). The epoxy-terminated dendrimer was reacted with aminopropylalkoxysilanes to yield the next-generation dendrimer bearing dialkoxy and trialkoxy silane groups. The dendrimers were characterized by the usual physico-chemical techniques, i.e. elemental analysis, FT-IR, 1 H, 13 C and 29 Si NMR. Thermal studies (Thermogravimetric analysis and Thermomechanical analysis) of the alkoxy terminated dendrimers and its cured products were also carried out.

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Poly(vinyl chloride) and wood flour press mould composites: New bonding strategies

Rocha

Coelho

Fonseca

et al. 2009

J of Applied Polymer Sci

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In this work, different strategies for improving the association between hydrophilic wood flour surfaces and poly(vinyl chloride) (PVC) hydrophobic surfaces were tested. Three new coupling agents, based on living radical polymerisation (LRP), involving PVC were synthesised and tested in formulations with PVC and wood flour. The melt mixing behaviour was analysed in terms of the torque exerted by the mixing blades and related to the structural properties of the mixture. These products were ground and sheets were produced by press moulding. The composites were characterised by dynamic mechanical analysis. It was found that the use of a new block copolymer poly(vinyl chloride)-b-poly(hydroxypropyl acrylate)-b-poly(vinyl chloride), prepared by LRP, increases the elastic modulus of the composite, under controlled conditions, involving the use of specific amounts of the copolymer.

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Kinetic analysis of organosilane hydrolysis and condensation

Cited by 56 publications

References 12 publications

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

The investigation of methyl phenyl silicone resin/epoxy resin using epoxy-polysiloxane as compatibilizer

Studies on the synthesis and thermal properties of alkoxysilane‐terminated organosilicone dendrimers

Poly(vinyl chloride) and wood flour press mould composites: New bonding strategies

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