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良美, 田辺; 直也, 長谷川; 実, 小高

doi:10.4139/sfj1950.34.452

Cited by 11 publications

(2 citation statements)

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“…, Cd 11) , Co 12) , Cr 13) , Cu 14) , Fe 15) , Ni 16,17) , Pt 18) , Ru 19) , Sn 20,21) , Zn 22) )，そして 26 種類の二元合金(Ag Co 23,24) , Al Mn 25 27) , Ag Cu 28) , Au Ni 29) , Au Pd 30,31) , Au Sn 32) , Co Cu 33,34) , Co Fe 35) , Co Ni 36) , Co S 37) , Co W 38) , Cu Ni 39) , Cu Pb 40) , Cu Sn 41) , Fe Mo 42) , Co Mo 42) , Ni Mo 42) , Fe Ni 43,44) , Fe W 45) , Fe Zn 46) , In Sn 47) , Ni B 48 50) , Ni P 51 53) , Ni S 54) , Ni Sn 55 58) , Ni W 59 …”

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Structure Control Theory of Plated Film —Part of Surface Morphology—

Watanabe

2002

J. Japan Inst. Metals and Materials

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The author has investigated the relationship between the structure of the plated film and plating conditions for 12 pure metals and 28 binary alloys. The structure of the plated film can be discussed based on metallurgical structure, surface morphology, crystal size, crystallographic orientation, adhesion between the plated film and substrate, retained stress, and anomalous structure. The control mechanisms of these features can be independently explained, since there is an independent control theory for each feature. This paper explains the unique control theory for surface morphology of plated films proposed by the author. In discussing surface morphology, two cases must be considered separately: pure metals and alloys. Discussions of pure metal films can be further subdivided into those with low melting points and those with high melting points. Generally, the crystals of plated alloy films are small, and the surface morphology depends on the crystallographic structure of the alloy film. The roughness of the plated film increases with film thickness and is hardly influenced by current density. When the current density is low, the surface roughness dominates. When current density is high, the surface is relatively smooth for both pure metal films and alloy films. It is not due to over voltage. The type of anion in the plating bath influences the nature of the roughness.

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Structure Control Theory of Plated Film —Part of Surface Morphology—

Watanabe

2002

J. Japan Inst. Metals and Materials

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“…[10][11][12] Because cyanogens are toxic substance, Sn-Ag alloy deposition from noncyanide solutions was investigated in this work from the viewpoint of environmental pollution. Two types of solutions were examined for Sn-Ag alloy deposition.…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Sn–Ag Alloys and Evaluation of Connection Reliability for Automotive Connectors

et al. 2010

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Electrodeposition behavior of Sn-Ag alloys was investigated at current density 1-1000 AÁm À2 in both sulfate and pyrophosphate-iodide solutions at 298 K, and the contact resistance of Sn-Ag alloys deposited on a Cu connector was evaluated. In both solutions, Ag behaved as a more noble metal than Sn, showing regular codeposition. The difference in deposition potential between Ag and Sn was 0.4 V in the pyrophosphate-iodide solution and 0.2 V in a sulfate solution containing thiourea as a complexing agent for Ag þ ions. The deposits obtained from a pyrophosphate-iodide solution consisted of blocks of a few microns in size, while those from a sulfate solution exhibited grains smaller than 1 mm. The deposits containing Ag less than 45 mass% were composed of an Ag 3 Sn intermetallic compound and Sn. This is in accordance with the equilibrium phase diagram of the binary Ag-Sn system. The contact resistance of deposited Sn-Ag alloys, after heating at 433 K for 120 h, was slightly smaller at Ag content below 45 mass% than that of reflow Sn plating. The connection reliability of connectors after abrasion was better in deposited films of Sn-Ag alloys than in those with reflow Sn plating.

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