2018
DOI: 10.1016/j.actamat.2018.07.058
|View full text |Cite
|
Sign up to set email alerts
|

Junction growth in ultrasonic spot welding and ultrasonic additive manufacturing

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

1
28
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
7
1
1

Relationship

1
8

Authors

Journals

citations
Cited by 42 publications
(36 citation statements)
references
References 71 publications
1
28
0
Order By: Relevance
“…Metallurgical bonds between layers are achieved ultrasonically without generating molten metal at the interface [3], and this allows for a wide range of similar and dissimilar materials to be deposited. Also, UAM has a higher deposition rate as compared to other AM processes because of the lower heat input per deposited volume and faster heat dissipation [3,25]. Due to the solidstate bonding in UAM, residual stresses and distortions are significantly reduced compared to direct metal deposition, which involves liquid-solid transformation.…”
Section: Uam Versus Other Am Technologiesmentioning
confidence: 99%
“…Metallurgical bonds between layers are achieved ultrasonically without generating molten metal at the interface [3], and this allows for a wide range of similar and dissimilar materials to be deposited. Also, UAM has a higher deposition rate as compared to other AM processes because of the lower heat input per deposited volume and faster heat dissipation [3,25]. Due to the solidstate bonding in UAM, residual stresses and distortions are significantly reduced compared to direct metal deposition, which involves liquid-solid transformation.…”
Section: Uam Versus Other Am Technologiesmentioning
confidence: 99%
“…In ultrasonic spot welding and ultrasonic additive manufacturing, junction growth results from thermal softening of surface asperities due to frictional heating. [ 67 ] Similarly, the distinct consolidation behaviors of the temperature‐sensitive pure Cu material and the thermally stable CuTa alloy indicate that thermal softening controls junction growth during ultrasonic powder compaction.…”
Section: Mechanisms Of Junction Growth Jamming and Densificationmentioning
confidence: 99%
“…Ultrasonic welding technology is continuously expanding its usage range. It has been applied to additive manufacturing (AM) technology, which is in recent demand [17,18]. Wu [19] fabricated Ni-based bulk metallic glasses using ultrasonic welding technology.…”
Section: Introductionmentioning
confidence: 99%