Abstract:Today, thermal interface materials (TIM) are widely used between a processor die and an integrated heat-spreader (IHS) to provide a good thermal conduction path for heat transfer from the electronic package. As the current trend towards larger “die size designs” progresses, the performance and reliability of the TIM will be a greater challenge for thermal engineers. In these larger die size designs, the TIM will experience increased movement as a result of the coefficient of thermal expansion (CTE) mismatch be… Show more
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