Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4<sup>th</sup> Industrial Revolution Era

Choi, MiKyeong; Jung, HyunHye; Oh, Kwangseok; Ryu, Dongsu; Lee, SangHyoun; Do, WonChul; Kweon, Young-Do; Kelly, Mike; Park, KyungRok; Khim, JinYoung; Huemoeller, Ron

doi:10.1109/ectc32862.2020.00211

Cited by 6 publications

(2 citation statements)

References 4 publications

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“…Thermal paste exhibits fluidic properties that allow it to effectively fill the gap between the heat source and heat sink, thereby improving the interfacial heat transfer performance. However, thermal paste moves out of the interface owing to the “pump-out” effect caused by the heat expansion of the interface during device operation, thereby reducing the heat transfer performance and, consequently, degrading the device performance [ 5 , 6 ]. Thermal pads have adequate flexibility and adhesive strength, ensuring their reusability; however, their heat transfer performance is relatively low [ 7 ].…”

Section: Introductionmentioning

confidence: 99%

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

et al. 2023

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Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-type TIMs; however, conventional thermal pads comprise a homogeneous polymer with low thermal conductivity. Composite materials of thermally conducting fillers and polymer matrices are considered suitable alternatives to high-performance pad materials owing to their controllable thermal properties. However, they degrade the thermal performance of the filler materials at high loading ratios via aggregation. In this study, we propose novel nanocomposites using densely aligned MgO nanowire fillers and polydimethylsiloxane (PDMS) matrices. The developed nanocomposites ensured the enhanced thermal conducting properties, while maintaining mechanical flexibility. The three-step preparation process involves the (i) fabrication of the MgO structure using a freeze dryer; (ii) compression of the MgO structure; and (iii) the infiltration of PDMS in the structure. The resulting aligned composites exhibited a superior thermal conductivity (approximately 1.18 W m−1K−1) to that of pure PDMS and composites with the same filler ratios of randomly distributed MgO fillers. Additionally, the MgO/PDMS composites exhibited adequate electrical insulating properties, with a room-temperature resistivity of 7.92 × 1015 Ω∙cm.

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Section: Introductionmentioning

confidence: 99%

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

et al. 2023

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“…To date, various types of highly thermally conductive materials have been researched based on filler types, shapes, and content [ 1 , 2 , 3 , 4 ]. According to the theoretical models that have already been set up to calculate the TCs of organic–inorganic composites, many researchers have attempted to predict effective TCs by comparing the measured TCs with the calculated values from these models.…”

Section: Introductionmentioning

confidence: 99%

The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages

Choi¹,

Park²,

Lee³

2023

Polymers

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This study suggests promising candidates as highly thermally conductive adhesives for advanced semiconductor packaging processes such as flip chip ball grid array (fcBGA), flip chip chip scale package (fcCSP), and package on package (PoP). To achieve an extremely high thermal conductivity (TC) of thermally conductive adhesives of around 10 Wm−1K−1, several technical methods have been tried. However, there are few ways to achieve such a high TC value except by using spherical aluminum nitride (AlN) and 99.99% purified aluminum oxide (Al2O3) fillers. Herein, by adapting highly sophisticated blending and dispersion techniques with spherical AlN fillers, the highest TC of 9.83 Wm−1K−1 was achieved. However, there were big differences between theoretically calculated TCs that were based on the conventional Bruggeman asymmetric model and experimentally measured TCs due to the presence of voids or pores in the composites. To narrow the gaps between these two TC values, this study also suggests a new experimental model that contains the porosity effect on the effective TC of composites in high filler loading ranges over 80 vol%, which modifies the conventional Bruggeman asymmetric model.

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Low-melting metal thermal interface material for high-power package application

Choi

Jung

2023

J. Korean Phys. Soc.

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Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4^th Industrial Revolution Era

Cited by 6 publications

References 4 publications

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages

Low-melting metal thermal interface material for high-power package application

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Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

Cited by 6 publications

References 4 publications

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages

Low-melting metal thermal interface material for high-power package application

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Product

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Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4^th Industrial Revolution Era