“…However, despite the increases in bond remelting temperature that can be achieved by complete homogenization, an adequate homogenization time is usually determined by a sufficiently high bond strength [2,24,26,42,83,103,122,123,146,150] or economic considerations that limit furnace time [77,125,173]. Nonetheless, the bond's remelting temperature is often hundreds of degrees (°C) above the melting point of the interlayer and can be about 1000°C higher if refractory metals such as Ir, Mo, Nb, Os, Re, Ta, or W are used as the [65,97] substrate or if low melting-point metals such as Al, Ga, In, Mg, Pb, Sb, Sn, or Zn are used as the interlayer.…”