Isothermal solid-state aging of Pb–5Sn solder bump on Ni/Cu/Ti under bump metallization

Chen, Chih‐Ming; Wang, Kai-jheng; Chen, Ko-chieh

doi:10.1016/j.jallcom.2006.05.116

Cited by 32 publications

(11 citation statements)

References 15 publications

(14 reference statements)

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“…Cu-based UBM (e.g., Cr/Cu/Au and Cr-Cu/Cu/Au) is commonly used to join with Sn-Pb solder. [3][4][5] Ni-based UBM, such as Ti/Cu/Ni 6,7 and Ti/Ni(V)/Cu, [8][9][10][11][12][13][14][15] has been proposed as a substitute for Cu-based UBM, since Ni showed a lower reaction rate with Sn. To overcome the magnetic interference of a pure Ni target during sputtering, 7 wt.% V is added to Ni in Ti/Ni(V)/Cu UBM.…”

Section: Introductionmentioning

confidence: 99%

Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging

Wang

Duh

2009

Journal of Elec Materi

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Ti/Ni(V)/Cu underbump metallization (UBM) is widely used in flip-chip technology today. The advantages of Ti/Ni(V)/Cu UBM are a low reaction rate with solder and the lack of a magnetic effect during sputtering. Sn atoms diffuse into the Ni(V) layer to form a Sn-rich phase, the so-called Sn-patch, during reflow and aging. In this study, the relationship between interfacial reaction and mechanical properties of the solder joints with Ti/Ni(V)/Cu UBM was evaluated. Sn-3.0Ag-0.5Cu solder was reflowed on sputtered Ti/Ni(V)/Cu UBM, and then the reflowed samples were aged at 125°C and 200°C, respectively. (Cu,Ni) 6 Sn 5 was formed and grew gradually at the interface of the solder joints during aging at 125°C. The Sn-patch replaced the Ni(V) layer, and (Ni,Cu) 3 Sn 4 was thus formed between (Cu,Ni) 6 Sn 5 and the Sn-patch at 200°C. The Sn-patch, composed of Ni and V 2 Sn 3 after reflow, was transformed to V 2 Sn 3 and amorphous Sn during aging. Shear and pull tests were applied to evaluate the solder joints under various heat treatments. The shear force of the solder joints remained at 421 mN, yet the pull force decreased after aging at 125°C. Both the shear and pull forces of the solder joints decreased during aging at 200°C. The effects of aging temperature on the mechanical properties of solder joint were investigated and discussed.

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Section: Introductionmentioning

confidence: 99%

Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging

Wang

Duh

2009

Journal of Elec Materi

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“…6d-f. Figure 6d shows that the AgZn IMC is dominant after aging at 160°C for 2 days; however, some needle-like Ag 59 Sn 29 Zn 12 IMCs were gradually formed in AgZn with increasing aging time, as displayed in Fig. 6e.…”

Section: Interfacial Reactions Between Sn-4ag-7zn and Agmentioning

confidence: 92%

“…24 A considerable number of researchers have focused on the interfacial reactions between Cu or Ni and leadfree solders. [25][26][27][28][29] The effect of Cu addition on the interfacial reactions between Sn-9Zn and Ag substrates has also been investigated. 15 However, there are limited data about the interfacial reactions between Sn-4Ag-xZn and Ag substrates.…”

Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Zou

Zhang

2008

Journal of Elec Materi

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In this study, the effect of Zn (Zn = 1 wt.%, 3 wt.%, and 7 wt.%) additions to Sn-4Ag solder reacting with Ag substrates was investigated under solid-state and liquid-state conditions. The composition and microstructure of the intermetallic compounds (IMCs) significantly changed due to the introduction of different Zn contents. In the case of Sn-4Ag solder with 1 wt.% Zn, a continuous Ag-Sn IMC layer formed on the Ag substrates; discontinuous Ag-Zn layers and Sn-rich regions formed on the Ag substrates under liquid-state conditions when the Sn-4Ag solders contained 3 wt.% and 7 wt.% Zn. If 3 wt.% Zn was added to Sn-4Ag solder, the Ag-Sn IMC would be transformed into a Ag-Zn IMC with increasing aging time. Rough interfaces between the IMCs and the Ag substrates were observed in Sn-4Ag-7Zn/Ag joints after reflowing at 260°C for 15 min; however, the interfaces between the IMCs and the Ag substrates became smooth for Sn-4Ag-1Zn/Ag and Sn-4Ag-3Zn/Ag joints. The nonparabolic growth mechanism of IMCs was probed in the Sn-4Ag-3Zn/Ag joints during liquid-state reaction, and can be attributed to the detachment of IMCs. On the other hand, the effect of gravity was also taken into account to explain the formation of IMCs at the three different interfaces (bottom, top, and vertical) during the reflow procedure.

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“…One was that the Cu 6 Sn 5 phase layer did not remain at the Bi/Cu interface but detached from the Cu substrate, and a continuous Bi phase layer was inserted in between them. Detachment (spalling) of IMCs from the joint interface had been observed in many solder joint systems and this phenomenon was attributed to the change of local equilibrium at the interface due to depletion of one reacting element [7][8][9][10][11]. At the Bi/Cu 6 Sn 5 /Cu interface, though the Cu supply from the Cu substrate was sufficient, the other reacting element (Sn) for the Cu 6 Sn 5 phase growth was lacking no matter from the Bi matrix or the Cu substrate.…”

Section: Microstructural Characterization Of Die-bonding Structuresmentioning

confidence: 99%

Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material

Wang

Lee

Chen

et al. 2016

Microelectronics Reliability

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Isothermal solid-state aging of Pb–5Sn solder bump on Ni/Cu/Ti under bump metallization

Cited by 32 publications

References 15 publications

Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging

Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material

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