Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Zou, Hui; Zhang, Z.F.

doi:10.1007/s11664-008-0490-8

Cited by 11 publications

(4 citation statements)

References 43 publications

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“…Furthermore, Zou and Zhang [34] investigated the impact of adding Zn to Sn-4Ag interacting with an Ag substrate. The authors discovered that increment in the Zn content in the Sn-4Ag solder causes the Ag-Sn IMC to become dominant at the interface, with the exception of the thinner Ag-Zn IMC.…”

Section: Formation and Growth Of Imc At The Solder-substrate Interfacementioning

confidence: 99%

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

et al. 2022

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Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.

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Section: Formation and Growth Of Imc At The Solder-substrate Interfacementioning

confidence: 99%

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

et al. 2022

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“…This resulted in less Zn at the interface compared to Sn-9Zn solder. The reason for the Zn preference for reacting with Ag over Ni was the easy availability of Ag in the solder matrix and a low Gibbs free energy for the formation of AgZn 3 (Hultgren et al, 1973;Zou and Zhang, 2008).…”

Section: Comparison Of Soldering Mechanismsmentioning

confidence: 99%

Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

Mittal

Lin

2014

Soldering &Amp; Surface Mount Technology

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Purpose – This paper aims to compare the reflow and Zn diffusion behaviors in Sn-Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (5E) solders during soldering on a Ni/Cu substrate under infrared (IR) reflow. The study proposes a model on the effect of various elements particularly Zn diffusion behavior in the solders on the formation of intermetallic compounds (IMCs). Design/methodology/approach – The melting activities of two solders near their melting points on copper substrates are visualized in an IR reflow furnace. Reflowed solder joints were analyzed using scanning electron microscope and energy dispersive X-ray spectroscopy. Findings – Reflow behaviors of the solders are similar. During melting, solder balls are first merged into each other and then reflow on the substrate from top to bottom. Both solders show a reduced amount of Zn in the solder. Theoretical calculations demonstrate a higher Zn diffusion in the 5E solder; however, the amount of Zn actually observed at the solder/substrate interface is lower than Sn-9Zn solder due to the formation of ZnAg3 in the solder. A thinner IMC layer is formed at the interface in the 5E solder than the Sn-Zn solder. Research limitations/implications – The present work compares the 5E solder only with Sn-Zn solder. Additional research work may be required to compare 5E solder with other solders like Sn-Ag, SnAgCu, etc. to further establish its practical applications. Practical implications – The study ascertains the advantages of 5E solder over Sn-Zn solder for all practical applications. Originality/value – The significance of this paper is the understanding of the relation between reflow behavior of solders and reactivity of different elements in the solder alloys and substrate to form various IMCs and their influence on the formation of IMC layer at solder/substrate interface. Emphasis is provided for the diffusion behavior of Zn during reflow and respective reaction mechanisms.

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“…[10][11][12][13][14][15][16] The thickness of the immersion Ag layer deposited on the Cu metallization was typically between 0.5 lm and 2 lm, and the Ag quickly dissolved into the molten solder during the reflow, exposing the Cu layer to the molten solder. As a result, only Cu-Sn IMCs such as Cu 6 Sn 5 and Cu 3 Sn are expected to form at the interface and plated Ag does not modify the interfacial reactions of the Zn-free solders, [12][13][14] which would degrade the impact resistance of solder joints due to the inherently brittle nature of Cu-Sn IMCs.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM

Jee

2010

Journal of Elec Materi

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The solder joint microstructures of immersion Ag with Sn-xZn (x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn 3 /Ag 5 Zn 8 at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into Cu 5 Zn 8 and Ag 3 Sn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle Cu 6 Sn 5 phase at the joint interface.

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Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Cited by 11 publications

References 43 publications

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM

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