Isothermal Fatigue Behavior of Sn-Pb Solder Joints

Summers, T.; Morris, J. W.

doi:10.1115/1.2904364

Cited by 21 publications

(4 citation statements)

References 7 publications

(17 reference statements)

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“…Significant creep rate has been substantiated for a broad range of solder compositions at ambient temperature under a moderate load. 12 Studies in the literature [13][14][15][16][17] have attributed solder joint failures to isothermal low-cycle fatigue in shear at high temperature or to thermomechanical fatigue as a result of temperature fluctuation. It is believed that the mechanism of solder joint failure involves the interaction of more than one basic failure process.…”

Section: Status Of Technologymentioning

confidence: 99%

Lead‐free Solders for Electronic Packaging and Assembly

Hwang

Guo

1994

Circuit World

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Access to this document was granted through an Emerald subscription provided by emerald-srm:108061 [] For AuthorsIf you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation.ABSTRACT-In terms of science, technologies and end-use applications, 'lead-free solders' are a very broad subject. This paper is intended to highlight the key issues of this broad subject for its applications in electronic packaging and assembly. The areas covered include the main thrusts behind the research and development effort, the scientific approaches, economic and practical considerations, and regulatory and legislative perspectives of lead. In addition, this paper will present the new findings as a result of research and development effort on lead-free solders.Technologically, in view of the current and future needs in interconnecting materials, the first objective of this work is to demonstrate the ability to provide lead-free solders in lieu of conventional lead-bearing solders without mandating significant changes in manufacturing processes and/or equipment which have been established and proven in the industry. The second objective is to design the lead-free solders which are able to offer superior performance to their Sn/Pb counterparts, thus providing solder interconnections with higher reliability and endurance during service life. The fulfilment of these two objectives will concurrently address the two critical technological areas in the field of solders, namely the inherent vulnerability of conventional solders to temperature and stress, and the concerns of toxicity and health hazard of lead.Based on materials principles, ternary and quaternary lead-free systems are at present being designed. The work conducted thus far demonstrates that two of the designed solder compositions show great promise. In comparison with 63Sn/37Pb eutectic solder, the new lead-free compositions exhibit superior performance in shear strength, creep resistance and thermomechanical fatigue resistance. This paper will also cover the data in mechanical testings, the summary of microstructure evaluation (with detailed elucidation omitted), and low-cycle fatigue fractoqraphy examination of the designed lead-free compositions.

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Section: Status Of Technologymentioning

confidence: 99%

Lead‐free Solders for Electronic Packaging and Assembly

Hwang

Guo

1994

Circuit World

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“…The major cause of solder joint failure is low cycle fatigue due to thermal mismatch and the mechanical load under transportation or usage, as in a cell phone or NoteBook computer. [6][7] Therefore, soldier joint fatigue testing and life prediction are the most important issues in solder joint reliability.…”

Section: Introductionmentioning

confidence: 99%

Gold Wire and Solder Joint Microforce Testing Using Microforce Tester

Chao

Liu

2003

Experimental Techniques

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“…1,2 Therefore, evaluating the mechanical strength of solder joints is of critical importance to improving the reliability and service life of portable consumer products. Solder joints have a crucial role in providing electrical and thermal connectivity throughout an electronic package.…”

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confidence: 99%

“…Although solder joints can fail as a result of low-cycle fatigue induced by thermal mismatches within a package, the most common cause of solder joint failure in portable electronic products is high-speed impacts caused when a product is dropped. 1,2 Therefore, evaluating the mechanical strength of solder joints is of critical importance to improving the reliability and service life of portable consumer products. The mechanical properties of solder ball joints are generally evaluated using a drop test.…”

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confidence: 99%