Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)
DOI: 10.1109/ipfa.2002.1025631
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Isothermal em as highly accelerated test method for copper damascene lines

Kenneth Leong1,
Y. Andrew2,
Bee Hoon Lim3
et al.
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