Effect of reduced current density stress on the results of isothermal electromigration test for Cu single damascene line

Leong, Kenneth; Andrew, Y.; Lim, Bee Hoon

doi:10.1109/irws.2002.1194234

IEEE International Integrated Reliability Workshop Final Report, 2002.

DOI: 10.1109/irws.2002.1194234

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Effect of reduced current density stress on the results of isothermal electromigration test for Cu single damascene line

Kenneth Leong¹,

Y. Andrew²,

Bee Hoon Lim³

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Effect of reduced current density stress on the results of isothermal electromigration test for Cu single damascene line

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References 10 publications

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