Investigation on the copper void defect by Transmission Electron Microscope (TEM)

Soo, Chi Wen; Zhu, Jie

doi:10.1109/ipfa53173.2021.9617357

2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2021

DOI: 10.1109/ipfa53173.2021.9617357

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Investigation on the copper void defect by Transmission Electron Microscope (TEM)

Chi Wen Soo

Jie Zhu

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Investigation on the copper void defect by Transmission Electron Microscope (TEM)

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