2004
DOI: 10.1016/j.apsusc.2004.05.148
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Investigation on the barrier height and phase transformation of nickel silicide Schottky contact

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Cited by 20 publications
(11 citation statements)
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“…Although Schottky interfaces have been well studied for over 50 years, it is only in the past decade that an inhomogeneous contact [5][6][7][8][9][10][11][12][13][14][15] has been considered as an explanation for a voltagedependent barrier height [14][15][16][17][18][19][20][21][22][23][24][25][26]. As mentioned in Refs.…”
Section: Introductionmentioning
confidence: 99%
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“…Although Schottky interfaces have been well studied for over 50 years, it is only in the past decade that an inhomogeneous contact [5][6][7][8][9][10][11][12][13][14][15] has been considered as an explanation for a voltagedependent barrier height [14][15][16][17][18][19][20][21][22][23][24][25][26]. As mentioned in Refs.…”
Section: Introductionmentioning
confidence: 99%
“…Schottky barrier diodes (SBDs) are of the most simple of the MS contact devices [1][2][3][4][5][6][7], a full understanding of the nature of their electrical characteristics is of great technological importance in the electronics industry [7][8][9][10][11][12][13]. Although Schottky interfaces have been well studied for over 50 years, it is only in the past decade that an inhomogeneous contact [5][6][7][8][9][10][11][12][13][14][15] has been considered as an explanation for a voltagedependent barrier height [14][15][16][17][18][19][20][21][22][23][24][25][26].…”
Section: Introductionmentioning
confidence: 99%
“…In particular, the Schottky diodes have important applications in bipolar integrated circuits such as clamps, load resistor, couplers, and level shifters [8,9]. Moreover, Schottky diodes with low barrier height (BH) play an important role in devices operating at cryogenic temperatures as infrared detectors, sensors in thermal imaging, microwave diodes, gates of transistors and infrared and nuclear particle detectors [9][10][11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…A maximum barrier height was obtained at annealing temperature of 550°C to 600°C. 22 Roccaforte et al found that, for the Ni/SiC contact, as the annealing temperature was increased from 500°C and above, nickel-rich silicides such as Ni 31 Si 12 form prior to conversion to the more stable Ni 2 Si. 23 We propose the following explanation for the drop in series resistance shown in Fig.…”
Section: Resultsmentioning
confidence: 98%