Investigation of the thermal deformation of a chip-scale packaged optical accelerometer

Fang, Weidong; Wang, Chen; Bai, Jian; Chen, Jiaxiao; Yao, Yuan; Lu, Qiuyu

doi:10.1016/j.measurement.2020.108017

Cited by 5 publications

(2 citation statements)

References 32 publications

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“…Since the low thermal expansion coefficient of the grating on a quartz substrate, grating interferometers have the features of high reliability, high sensitivity, and small zero deviation drift. In recent years, researchers have applied grating interferometers to acceleration sensors and obtained good results [ 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 ]. In order to further improve the performance of the grating accelerometer, the acceleration and displacement sensing element of the elastic coefficient, the mass block, and the cross-axis suppression ratio needs to be further optimized.…”

Section: Introductionmentioning

confidence: 99%

Design and Modification of a High-Resolution Optical Interferometer Accelerometer

Yao

Pan

Wang

et al. 2021

Sensors

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The Micro-Opto-Electro-Mechanical Systems (MOEMS) accelerometer is a new type of accelerometer that combines the merits of optical measurement and Micro-Electro-Mechanical Systems (MEMS) to enable high precision, small volume, and anti-electromagnetism disturbance measurement of acceleration, which makes it a promising candidate for inertial navigation and seismic monitoring. This paper proposes a modified micro-grating-based accelerometer and introduces a new design method to characterize the grating interferometer. A MEMS sensor chip with high sensitivity was designed and fabricated, and the processing circuit was modified. The micro-grating interference measurement system was modeled, and the response sensitivity was analyzed. The accelerometer was then built and benchmarked with a commercial seismometer in detail. Compared to the previous prototype in the experiment, the results indicate that the noise floor has an ultra-low self-noise of 15 ng/Hz1/2.

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Section: Introductionmentioning

confidence: 99%

Design and Modification of a High-Resolution Optical Interferometer Accelerometer

Yao

Pan

Wang

et al. 2021

Sensors

Self Cite

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“…Nevertheless, temperature variations considerably influence the measurement accuracy of these precise instruments [3]. Research shows the structure deformation caused by using common materials, such as aluminum (Al), steel, and iron, is necessary to fabricate workpieces to improve stability, for example symmetrical design, grooving, and honeycomb structure [13][14][15]. Nonetheless, the thermal deformation model of workpieces must be obtained before manufacture.…”

Section: Introductionmentioning

confidence: 99%

Modeling and improvement for the thermal stability of ring-shaped workpieces with shape boundary constraints

Wang,

Li,

Zhao

et al. 2024

Meas. Sci. Technol.

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Ring-shaped workpieces are commonly utilized in high-precision measuring instruments, and their thermal deformation affects the instruments’ measuring accuracy. A novel method for establishing the thermal deformation model of ring-shaped workpieces is proposed in this article. The mechanism of thermal deformation caused by shape boundaries is investigated using the principle of molecular dynamics. A mathematical model between deformation degree and height, diameter ratio, or temperature is created using a large-scale atomic/molecular massively parallel simulator. The established model is verified by measuring the thermal deformation of ring-shaped workpieces. The model is used to optimize laser collimation systems, and stability experiments for laser collimation systems in different sizes are performed. The stability of optimized systems can be improved by 50%, 50%, and 48% with temperature increases of 10 °C, 20 °C, and 30 °C, respectively. The experimental results indicate the obtained model can be utilized to improve the stability of instruments.

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Temperature compensation in high accuracy accelerometers using multi-sensor and machine learning methods

Iafolla,

Santoli,

Carluccio

et al. 2024

Measurement

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Investigation of the thermal deformation of a chip-scale packaged optical accelerometer

Cited by 5 publications

References 32 publications

Design and Modification of a High-Resolution Optical Interferometer Accelerometer

Design and Modification of a High-Resolution Optical Interferometer Accelerometer

Modeling and improvement for the thermal stability of ring-shaped workpieces with shape boundary constraints

Temperature compensation in high accuracy accelerometers using multi-sensor and machine learning methods

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