“…Recently, many types of 3D printing technology for constructing plastic materials, such as stereolithography (SLA), selective laser sintering (SLS), fused deposition molding (FDM), selective laser melting (SLM), laminated object manufacturing (LOM), digital beam melting (EBM), and digital light processing (DLP) have been rapidly developed [ 5 ]. Among them, FDM and SLA are the most common technologies used to print thermoplastics, thermosetting plastics, and composite materials, such as PLA (a biodegradable thermoplastic polyester derived from natural resources [ 5 , 9 , 10 , 11 ]), PVB (formed from the reaction of an aldehyde and alcohol [ 8 , 12 , 13 ]), and CW (a liquid wax [ 14 , 15 , 16 ]), with complex geometries and a wide range of designs quickly and efficiently [ 5 ]. From the above advantages, 3DP and plastics show great potential for applications in IC, which can help to enable a simple production process and provide design flexibility for complex features.…”