Investigation of preparation and characteristics of Sn–Bi eutectic powders derived from a high shear mechanical approach

Liang, Kun; Tang, Xianzhong; Lei, Yu; Ni, Wang; Hu, Wencheng

doi:10.1016/j.jallcom.2011.08.038

Cited by 4 publications

(2 citation statements)

References 32 publications

(29 reference statements)

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“…This result illustrates that the sample formed is a SnBi eutectic. 10 The diffraction peaks at 43?297, 50?433 and 74?130u are (111), ( 200) and (220) crystalline faces of the substrate Cu. The characteristic diffraction peaks (012), ( 104), ( 110), ( 015) and (202) at 27?165, 37?949, 39?618, 44?553 and 48?689u respectively conform to the rhombohedral Bi texture (lattice constants a5b5 4?547 A ˚, c511?862 A ˚and a5b590u, y5120u).…”

Section: X-ray Diffraction Analysismentioning

confidence: 99%

“…Various methods for preparing alloy solders have been attempted, such as chemical reduction, 7 sonochemistry, 8 cold–gas dynamic spray 9 and high temperature solvent system. 10 Compared with the abovementioned methods for SnBi alloy preparation, electrodeposition is a more versatile processing technique for depositing metals and alloys because it is inexpensive and relatively simple. 11…”

Section: Introductionmentioning

confidence: 99%

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Electrodeposition of SnBi coatings based on deep eutectic solvent

Gao

Duan

2014

Surface Engineering

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Tin-bismuth (SnBi) alloy coatings were satisfactorily electrodeposited on copper electrodes from a choline chloride-ethylene glycol deep eutectic solvent containing BiCl 3 , ZnCl 2 and H 3 BO 3 . The electrochemical feature of the electrolyte system was inspected via linear sweep voltammetry. The results indicated that the SnBi alloy coating was codeposited as the deposition potential was prolonged up to the potential range, leading to the inadequate deposition of zinc on the copper electrode. Dendrite formation, simple eutectics and diversification of grain size were studied through the results of the morphology and structure analyses. The X-ray diffraction results demonstrated an increasing grain size of Bi and an opposite trend of Sn when the potential increased. The relevance of the Bi at% of the codeposited BiSn on the deposition potential, temperature and Bi(II) molar ratio was investigated. The results indicated the possibility of electroplating the SnBi alloys with their composition around the eutectic point.

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Section: X-ray Diffraction Analysismentioning

confidence: 99%