Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole

Li, Zheng; He, Wei; Zhu, Kai; Wang, Chong; Wang, Shouxu; Yan, Hong; Chen, Yuanming; Zhou, Guoyun; Miao, Hongchen; Zhou, Jinqun

doi:10.1016/j.electacta.2018.06.132

Cited by 59 publications

(27 citation statements)

References 36 publications

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“…恰当的添加剂配方可以改变电极表面的极化电位, 调控孔内外不同区域铜沉积的速率, 从而实现无孔隙的超级填充 (Superfilling), 科学上将这一类的现象归纳为电镀铜填盲孔的问题 [11] (图 2). [12][13][14][15][16][17][18] , 聚乙烯亚胺(PEI) 、聚乙烯吡咯烷酮(PVP)等含氮聚合物 [19][20][21][22] 、以及十二烷基三甲基氯化铵(DTAC) 等季铵盐类表面活性剂 [23,24] , 能够起到抑制消除镀层上方的凸起(Bump)的形成的作用. 针对不同的电镀铜应用场景, 产业界需要优化出特定配方和施镀条件, 而这绝非易事.…”

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Advances in mechanistic understanding of additives for copper electroplating in high-end electronics manufacture

Mao

Wang

et al. 2021

Sci. Sin.-Chim

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Copper interconnect electroplating is one of the core technologies for the manufacture of high-end electronic devices including but not limited to chips. To promote the development of advanced copper interconnect process, it is necessary to clarify the mechanisms of copper electroplating additives. Herein, we provide a brief overview of the research progress on the interfacial structures and mechanisms of the three types of additives (accelerator, suppressor and leveler) in copper sulfate plating baths from a methodological perspective. Besides, the advantages and limitations of different research methods are discussed and the scientific issues related to the Damascene copper electroplating are summarized, to afford a hint for the further research and development of the additives in advanced chip fabrication.

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Advances in mechanistic understanding of additives for copper electroplating in high-end electronics manufacture

Mao

Wang

et al. 2021

Sci. Sin.-Chim

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“…Before the organic additive was added to the plating solution, original occasion was the diffusion‐controlled on copper electrodeposition (Δη=0) . When PEG was injected at 1000 s into the plating solution, a sharp dropping of cathodic potential was observed due to charge‐transfer‐controlled of PEG‐Cl . After SPS were injected into the electrolyte, the cathodic potential increase gradually, enhancing the copper deposition kinetics (Figure a), which is due to the slow displacement of adsorbed PEG by SPS .…”

Section: Resultsmentioning

confidence: 99%

“…[44,45] When PEG was injected at 1000 s into the plating solution, a sharp dropping of cathodic potential was observed due to chargetransfer-controlled of PEG-Cl. [46] After SPS were injected into the electrolyte, the cathodic potential increase gradually, enhancing the copper deposition kinetics (Figure 7a), which is due to the slow displacement of adsorbed PEG by SPS. [47] Uneven PEG/SPS surface covering is precondition for a bottom-up fill.…”

Section: Resultsmentioning

confidence: 99%

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Zhao

et al. 2019

ChemElectroChem

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A series of fatty acid quaternary ammonium surfactants (FAQAS 1 a–1 f) derived from renewable resource of fatty acid have been rationally designed and investigated as levelers applied in copper electroplating. Surface tension and contact angle indicated the FAQAS's surfactivity and wettability were closely related to the length of hydrophobic chains. FAQAS 1 a–1 f displayed the capability to inhibit the copper deposition in CV tests and their inhibiting abilities agreed with the order of their surfactivity and wettability. Compound 1 e showed the best inhibition capability, and was comprehensively tested by field‐emission scanning electron microscopy (FE‐SEM), X‐ray photoelectron spectroscopy (XPS) and other electrochemical measurements. The strong inhibition ability of compound 1 e on copper electrodeposition could be attributed to its fast and strong absorption of 1 e on the cathode surface. Moreover, galvanostatic measurements (GMs) indicated that compound 1 e not only cause polarization but also has stable synergistic effects with other additives to form a convection dependent competitive adsorption layer. In addition, through‐hole (TH) electroplating experiments verified that uniform TH could be obtained on copper electrodeposition using the bath containing compound 1 e. This work may shed some light on the pratical application of surfactants as effective leveler in acid copper electroplating.

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“…1−5 As is well known, the copper electrodeposition in acidic electrolytes plays a critical role in PCB manufacture. 6,7 The copper electroplating of the throughholes (THs) is especially performed to obtain the conductive interconnection between the layers in multilayer PCB. The growing complexity of electronic products promotes the development of HDI technology and puts forward higher quality requirements for the copper coating of TH.…”

Section: ■ Introductionmentioning

confidence: 99%

“…13−16 It is generally believed that Cl − can act as a synergistic inhibitor to hinder the copper electrodeposition. 6,7,13,14 There is a strong interaction between the accelerator and the metal surface. In the presence of Cl − , the accelerator has a strong adsorption effect on the copper surface.…”

Section: ■ Introductionmentioning

confidence: 99%

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Zhou

Yan

et al. 2020

ACS Omega

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A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.

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Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole

Cited by 59 publications

References 36 publications

Advances in mechanistic understanding of additives for copper electroplating in high-end electronics manufacture

Advances in mechanistic understanding of additives for copper electroplating in high-end electronics manufacture

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

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