“…A number of ways to reduce the impact of the aforementioned phenomena have been proposed. One of them is the surface modification of metallic interconnects, which involves the deposition of a protective-conducting layer by means of various methods, including screen-printing [24][25][26][27][28], dip-coating [29], electroplating [30][31][32][33][34], RF-sputtering [35], cost-effective atmospheric plasma spray (APS) [36,37] and large area filtered arc deposition (LAFAD) [38]. The materials that seem most suitable for such modifications based on current research are spinels with the following compositions: (Mn,Co) 2 O 3 [39][40][41][42][43][44][45][46], (Cu,Mn) 2 O 4 [47][48][49], (Co,Mn,Me) 2 O 3 (where Me: Cu, Ni, Fe, Ag, Ce, Y) [50][51][52][53][54][55][56][57].…”