“…have been produced by various deposition techniques, such as slurry coating (e.g., brush painting, wet powder spray, dip coating, and screen printing), 33,35,[106][107][108][109] thermal spray, [110][111][112][113][114][115][116][117] physical vapor deposition (PVD) (e.g., electron beam PVD, EBPVD, thermal evaporation, sputtering, etc. ), [118][119][120][121][122] electrodeposition, [123][124][125][126][127] electrophoretic deposition (EPD), 95,97,126,[128][129][130][131][132][133] etc. The choice of deposition techniques mainly depends on the coating composition/ thickness, surface topography of the interconnect, and cost of equipment.…”