“…Although NH 3 reacts with SiH 4 easily, the SiN x O y film produced by NH 3 at a lower temperature has a higher hydrogen content, which causes the decreased electrical performance of SiN x O y film, so some studies used RF-PECVD, with N 2 and SiH 4 as precursor gases to prepare SiN x O y film with lower hydrogen content, and some studies used RF-PECVD, with N 2 , SiH 4 and NH 3 as the front gases [76]. For example, Kijaszek et al [77] used RF-PECVD and maintained the RF of 13.56 MHz, pressure, power, and substrate temperature (350 °C), and controlled the composition of SiN x O y film by the flow ratio of different gaseous precursors: NH 3 , 2% SiH 4 /98% N 2 and N 2 O, wherein the flow rate of 2% SiH 4 /98% N 2 and N 2 O remained the same, and the flow rate of NH 3 is adjusted to control the SiN x O y film’s performance. When the flow rate of NH 3 is low, the SiN x O y film’s hydrogen content is also lowered, and the electrical performance of the SiN x O y film is improved.…”