Investigation of Manifold Microchannel Cooler for High-Heat-Flux Electronic Cooling of 1000 W/cm2 with Varying Manifold and Microchannel Height

Ma, Yupu; Wei, Tao; Huang, Haojie; Qian, Jiyu

doi:10.1007/978-981-19-1309-9_122

Cited by 2 publications

(1 citation statement)

References 17 publications

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“…Although the total consumption of power devices is not enormous, the local heat flux caused by the transistor gate's leakage current has exceeded 1000 W cm -2 . With the advantaged stacking package technology development, the power device microsystem package becomes further compact to endorse the miniaturization of high computing performance, communication technology, and other emerging electronic information systems 22,23 . The active cooling packages make it difficult to guarantee the junction temperature uniformity for the device array 24 .…”

Section: Introductionmentioning

confidence: 99%

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

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Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation.

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Section: Introductionmentioning

confidence: 99%