Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Abstract

Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation.