2015
DOI: 10.1016/j.jnoncrysol.2014.12.032
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Investigation of interface quality and passivation improvement with a-SiO:H deposited by ECRCVD at low temperature

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Cited by 3 publications
(3 citation statements)
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“…The distinct tolerances to crystallization characteristics of these structures were caused by their different oxygen concentrations. 24 Crosssectional TEM images of the NATURE contact before and after PDA at 750 °C are shown in Figure 3c,d, respectively. Figure 3e shows a magnification of the sample around the NATURE contact after PDA at 750 °C.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
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“…The distinct tolerances to crystallization characteristics of these structures were caused by their different oxygen concentrations. 24 Crosssectional TEM images of the NATURE contact before and after PDA at 750 °C are shown in Figure 3c,d, respectively. Figure 3e shows a magnification of the sample around the NATURE contact after PDA at 750 °C.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…Therefore, the a-SiO y layer suppressed the crystallization from the c-Si substrate. The distinct tolerances to crystallization characteristics of these structures were caused by their different oxygen concentrations . Cross-sectional TEM images of the NATURE contact before and after PDA at 750 °C are shown in Figure c,d, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…It is known that the composition and structural characteristics of the films are critically dependent on the method of synthesis . Earlier, the film suboxide of silicon were synthesized by electron cyclotron resonance chemical vapor deposition (ECRCVD) , plasma‐enhanced CVD (PECVD) , inductively coupled plasma enhanced chemical vapor deposition (ICPECVD) , very high frequency plasma enhanced chemical vapor deposition (VHF‐PECVD) , hot filament chemical vapor deposition (HFCVD) , and low pressure chemical vapor deposition (LPCVD) .…”
Section: Introductionmentioning
confidence: 99%