Investigation of green alkaline pH regulators on sapphire UV-CMP

Deng, Hongguang; Zhong, Min; Xu, Wenhu

doi:10.1016/j.triboint.2022.108047

Cited by 7 publications

(3 citation statements)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It is well known that nitric acid (HNO 3 ), potassium hydroxide (KOH), sodium hydroxide (NaOH), and strontium hydroxide (Sr(OH) 2 ) are often used as inorganic alkaline pH regulators [77,[110][111][112][113]. The FA/O chelating agent, aminopropanol (AMP) and sodium metasilicate (SMSN) are organic base pH regulators [114,115]. As we all know, Al 2 O 3 is an amphoteric oxide that will react with acids or bases.…”

Section: Changing the Ph Of The Slurrymentioning

confidence: 99%

Nanomaterials and Equipment for Chemical–Mechanical Polishing of Single-Crystal Sapphire Wafers

Li,

Fu,

et al. 2023

Coatings

View full text Add to dashboard Cite

Single-crystal sapphire (α-Al2O3) has been widely used in semiconductor, optics, communication, national defense, and other fields. Before application, an ultra-smooth surface which is scratch free and subsurface damage free is essential. Furthermore, the sapphire has unique qualities such as significant rigidity and chemical stability, which make it extremely arduous to process. Chemical mechanical polishing (CMP) is recognized as the final process to reduce the roughness and eliminate surface defects of a sapphire surface. In this review, the materials and equipment used for the chemical polishing of a sapphire wafer are summarized, and the surface nanoscale changes of sapphire wafer are reviewed from the angles of regulating polishing-process parameters, composition of polishing slurry including that which is nano-abrasive, a pH regulator, a complexing agent, and other additives, as well as hybrid CMP technologies. The outlook and future applications are also summarized.

show abstract

Section: Changing the Ph Of The Slurrymentioning

confidence: 99%

Nanomaterials and Equipment for Chemical–Mechanical Polishing of Single-Crystal Sapphire Wafers

Li,

Fu,

et al. 2023

Coatings

View full text Add to dashboard Cite

show abstract

“…Recently, some researchers have polished many materials and components (such as sapphire, diamond, and oxygen-free copper) with a green CMP process, and obtained extremely low surface roughness and ultra-smooth surface. [22][23][24][25][26] Xie and Deng et al polished sapphires with a polishing slurry prepared by environmental protection chemical reagents, such as aminomethyl propanol, and obtained excellent results with a surface roughness of about 0.1 nm. 22,23 Yuan et al polished diamond with a green polishing slurry containing chemical reagents, such as food-grade benzoic acid, to obtain an ultra-smooth surface with a 0.076 nm roughness.…”

Section: Introductionmentioning

confidence: 99%

“…[22][23][24][25][26] Xie and Deng et al polished sapphires with a polishing slurry prepared by environmental protection chemical reagents, such as aminomethyl propanol, and obtained excellent results with a surface roughness of about 0.1 nm. 22,23 Yuan et al polished diamond with a green polishing slurry containing chemical reagents, such as food-grade benzoic acid, to obtain an ultra-smooth surface with a 0.076 nm roughness. 24,25 Liu et al used NaHCO 3 and polyaspartic acid as auxiliary reagents to prepare a polishing slurry to polish oxygen-free copper, which also achieved excellent results.…”

Section: Introductionmentioning

confidence: 99%