Abstract:In most current wire-bonding applications, electrical interconnection is accomplished by fine Cu wires bonded to Al bonding pads microfabricated on an IC chip and external contact pins of the PCB board. Corrosion-related failure defects between the Cu wire and Al bond pad have been an ongoing un-trackable reliability issue plaguing the IC packaging industry for the past ten years, despite approaching ppb levels. Most prior studies hypothesized that intermetallic compounds (IMCs) like Cu9Al4, and CuAl2 were res… Show more
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