Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic

Abstract

The investigation of crosstalk issues for coupled through silicon vias (TSVs) in ternary logic is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi-walled carbon nanotube (MWCNT) as conductive filler, and polymer liners such as polyimide, polypropylene carbonate, and benzocyclobutene (BCB) as insulating materials. For the coupled TSVs, the electrical equivalent circuit model is used to investigate the crosstalk which is driven by the ternary inverter. Based on the Hewlett simulation program with integrated circuit emphasis simulations, the effects of crosstalk such as functional and dynamic crosstalk for proposed TSVs are compared with single-walled CNT (SWCNT) TSVs. Furthermore, the other performance parameters such as power dissipation, power delay product (PDP), and energy delay product are investigated. The crosstalk effects of the proposed model are also examined for various TSV heights. It is noticed that the BCB based coupled MWCNT TSVs provide a significant improvement in crosstalk at reduced TSV height. It is also noticed that the proposed TSVs improved the overall performance up to 30.21% compared to the SWCNT based TSVs. Hence, the MWCNT based TSVs with BCB liner are most suitable for ternary logic integrated circuits over the conventional TSVs.

Analysis of Crosstalk Effects for Ternary Logic MWCNT Bundled Through Silicon Vias

“…The resistance of proposed coupled TSVs (R T ) is given in Equation 1. 1 In the proposed TSVs, the R T occurs due to the scatterings of TSV edge roughness, acoustic phonon and static impurity.…”

“…Conversely, the 0.153 V noise margin is still suitable for developing the ICs. [1][2][3] Moreover, in ternary, high crosstalk is obtained at 0 ↔ 2 switching. Hence, the crosstalk effects are more essential in developing ternary circuits.…”

“…However, these requirements lead to issues such as chip complexity and amount of variations in developing the ICs. 1,2 These issues can be reduced with ternary logics. In recent days, the ternary logic provides degraded chip complexity, reduced wire length and transmits large data compared to conventional logic.…”

“…13,14 Hence, the CNTs are used as conductive liner in TSVs to overcome these issues. 1,2 The CNT liners provide wonderful electrical, mechanical and thermal properties in TSVs. [15][16][17][18] The SWCNT and MWCNT are two types of CNTs where the SWCNT have single nanotube and MWCNT have multiple nanotubes.…”

“…To reduce the large capacitance value and inaccuracies of SiO 2 , the polymer based dielectric liners such as polyimide, PPC and BCB can be used in TSVs. 1,13 Hence, utilizing MWCNT and polymer based liners in TSVs can provide high performance in ICs.…”