Analysis of Crosstalk Effects for Ternary Logic MWCNT Bundled Through Silicon Vias

Abstract

We present a technique to improve the crosstalk effects in ternary coupled through silicon vias (TSVs). The effects of crosstalk were investigated in TSVs using multi-walled carbon nanotube (MWCNT) as metallic liner and polymers such as polyimide, polypropylene carbonate, and benzocyclobutene (BCB) as dielectric liners. The circuit model for coupled TSVs driven by a ternary inverter was utilized to analyze the various crosstalk issues. The HSPICE tool was utilized to develop the proposed TSVs. The crosstalk issues for the MWCNT TSVs were investigated and compared to single-walled CNT (SWCNT) TSVs. Moreover, the power, power delay product, and energy delay product were analyzed and compared to SWCNT TSVs. All of the performances were also studied for different TSV pitches. The coupled TSVs with BCB showed high performance for the large pitch values. Moreover, it was noted that the coupled TSVs with BCB at 5000μm TSV pitch improved the performance up to 40.03% over the SWCNT TSVs.