Abstract:Silicon interposers enable the heterogeneous integration of high performance systems. This paper focuses on interconnections from one chip to a neighboring chip via an interposer. We use a typical silicon interposer with polymer applied to the redistribution layer on both sides and line/space of 10 µm. We point out important advantages and differences of the chip-to-chip interconnection in comparison to usual integration using a separate package for each chip and a printed circuit board. The electrical behavio… Show more
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