Investigating the mechanical strength of Vapor Phase soldered chip components joints

Krammer, Olivér; Garami, Tamas

doi:10.1109/siitme.2010.5653622

Cited by 17 publications

(10 citation statements)

References 5 publications

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“…) may also be a considerable problem. Without proper cooling down phase of the soldering profile, cracks and reduced shear strength (Krammer and Garami, 2010.) may also be observable on the solder joints.…”

Section: Introduction To the Technology Of Vapour Phase Solderingmentioning

confidence: 99%

Characterization of vapour phase soldering process zone with pressure measurements

Géczy

Illés

Péter

et al. 2013

Soldering &Amp; Surface Mount Technology

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Purpose: With the spreading of Vapour Phase Soldering (VPS) technology it is important to understand and optimize the process itself. The paper presents a novel approach on the process zone characterization for direct feedback on the state of vapour, for better monitoring, control and understanding of the process. Practical implications:The VPS process may benefit from the more precise saturation detection, giving better control on the heat transfer, enabling more efficient production with the reduction of idle time, and resulting in better soldering quality. Social implications:Reducing the idle time of the VPS stations may result in better efficiency and smaller power consumption, reducing the environmental impact of the method.

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Section: Introduction To the Technology Of Vapour Phase Solderingmentioning

confidence: 99%

Characterization of vapour phase soldering process zone with pressure measurements

Géczy

Illés

Péter

et al. 2013

Soldering &Amp; Surface Mount Technology

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“…Medgyes et al investigated the electrochemical migration on biodegradable materials [15], and showed that due to better wetting on different biodegradable substrates, the failure criteria may occur earlier during migration tests, compared to conventional PCBs. Our previous work focused on Cellulose Acetate (CA) and PLA materials [16][17][18]; the investigations were combined with vapour phase soldering (VPS) joining method, where quality concerning results were similar to the typical findings of VPS investigations [19][20][21][22][23] with lead-free solder alloys. Our papers also showed limiting factors of solder joint production (the biodegradable substrates have lower melting point and lower glass transition temperature than standard FR4 PCBs), and limiting mechanical parameters of the produced PCBs.…”

Section: Introductionmentioning

confidence: 82%

Investigating mechanical performance of PLA and CA biodegradable printed circuit boards

Géczy

Nagy

Hajdu

et al. 2015

2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Abstract-The paper presents a set of experiments investigating the mechanical performance of PCBs manufactured from biodegradable, sustainable polymers, compared to conventional materials. Cellulose Acetate (CA), Polylactic Acid (PLA) and FlameRetardant Class 4 (FR-4) substrates were compared during the experiments. The methods involved dynamic mechanical analysis (DMA), three-point bending tests and UL 94 flammability tests. Preliminary results show that the overall performance of the basic biodegradable, sustainable PCBs are considerably weaker compared to FR4 boards, however further improvements with additives and use in special applications can point to practical purposes of the substrates.

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“…The main advantages of VPS process are the more uniform heating than the infrared or convection technologies [3,4] and no overheating (since the soldering temperature cannot exceed the boiling point of the heat transfer fluid [3,4]). However the VPS has more intensive heating ability than the regular soldering technologies what can cause soldering failures (e.g.…”

Section: Introductionmentioning

confidence: 99%

Dependence of condensate thickness on the substrate properties during Vapour Phase Soldering

Illés

2015

2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)

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In this paper, the average and the range of the condensate layer thickness was investigated in the function of different substrate properties with numerical simulations of Vapour Phase Soldering (VPS). The condensate layer thickness is the main influencing factor during the heat transfer of the VPS process. The phase change on the substrate and the transfer mechanisms in the condensate layer were included in a threedimensional numerical model. Stationary and saturated vapour conditions were applied as boundary conditions, in order to separate the effects of the substrate properties from the effects of the realistic unsteady and nonhomogeneous vapour conditions. Three different substrate materials was studied: FR4, 94% Alumina and Insulated Metal Substrate (IMS). The effect of the substrate shapes and thicknesses was also studied. It was found that the thermal properties of the substrate has considerable effects on the formation of the condensate layer and consequently on the heat transfer of the VPS. It was also proven that shape of the substrates has non-ignorable effects since it affects the movement of the condensate on the surface of the substrate.

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Investigating the mechanical strength of Vapor Phase soldered chip components joints

Cited by 17 publications

References 5 publications

Characterization of vapour phase soldering process zone with pressure measurements

Characterization of vapour phase soldering process zone with pressure measurements

Investigating mechanical performance of PLA and CA biodegradable printed circuit boards

Dependence of condensate thickness on the substrate properties during Vapour Phase Soldering

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