Investigating the Influence of TiC and SiC Particle Concentration on Electrodeposited Ni-TiC-SiC Composite plating

Abstract

To elucidate the Ni crystal size and orientation, and to characterize the plating morphology, composition, and hardness, we examined the Ni composite platings electrodeposited from Ni baths containing TiC and SiC particles. The （Ni-TiC and Ni-TiC-SiC） orientation was more random than that of （Watt's Ni and Ni-SiC） . The Ni crystal size of （Ni-TiC and Ni-TiC-SiC） was finer. Moreover, （Ni-TiC and Ni-TiC-SiC） was found to be harder. Ni coated the surface of TiC particles on the Ni-TiC plating very easily creating a rougher surface and voids in the plating. The addition of SiC particles into the Ni-TiC （100 g dm -3 ） bath increased the SiC content and decreased the TiC content in the plating. When appropriate amounts of SiC and TiC were mixed, they produced a rough surface without a void. The Ni-TiC （100 g dm -3 ） -SiC （40 g dm -3 ） composite consisted of dense plating dispersed homogeneously with TiC and SiC particles. It exhibited equal hardness to that of Ni-TiC （100 g dm -3 ） .