2004
DOI: 10.1016/j.ijheatmasstransfer.2004.01.022
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Inverse determination of surface temperature in thin-film/substrate systems with interface thermal resistance

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Cited by 9 publications
(4 citation statements)
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“…Detailed discussion on the mechanism behind the phenomenon was also documented. On the other hand, many studies [25][26][27] have also documented the sensitive nature of the predictive accuracy of an inverse solution on the relative position between the measured and estimated quantities in transient heat conduction problems. However, most of them tackled the issue by just reporting the finding, and there has not been a study probing deeper to reveal the mechanism behind the sensitivity.…”
Section: Introductionmentioning
confidence: 99%
“…Detailed discussion on the mechanism behind the phenomenon was also documented. On the other hand, many studies [25][26][27] have also documented the sensitive nature of the predictive accuracy of an inverse solution on the relative position between the measured and estimated quantities in transient heat conduction problems. However, most of them tackled the issue by just reporting the finding, and there has not been a study probing deeper to reveal the mechanism behind the sensitivity.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, inverse methods for heat conduction problems have become widely used in theory and practice. These inverse heat conduction problems (IHCPs) are involved with finding the unknowns such as the boundary conditions [1,2], thermophysical properties [3][4][5][6][7][8][9], boundary configurations [10,11] and subsurface inclusions [12][13][14] from interior or surface temperature measurement. In this paper, the thermal conductivity distribution of the interlayer of a sandwich plate is estimated with an inverse method based on the surface temperature measurement.…”
Section: Introductionmentioning
confidence: 99%
“…In general, it is not easy to obtain analytical solutions to a dynamical magneto-thermo-viscoelastic problem in anisotropic materials. therefore, an important number of engineering and mathematical papers devoted to the numerical solution have studied the overall behavior of such materials (Oden and Armstrong, 1971;Ting and Chen, 1982;Dargush and Banerjee, 1991;Misra, et al, 1992;Chen, et al, 2009;Tsai, 2009;Xing and Makinouchi, 2002;El-Naggar, et al, 2002Abd-Alla, et al, 2003, 2008Wu and Chu, 2004;Baksi, et al, 2006;Hosseini, et al, 2007;Huang and Rosakis, 2007;Fahmy, 2008Fahmy, , 2009Fahmy and El-Shahat, 2008;Feng, et al, 2008;Othman and Song, 2008;Damanpack, et al (2013);Rafieipour, et al (2013)). …”
mentioning
confidence: 99%