A numerical method for determining thermal conductivity distribution of the interlayer of a sandwich plate based on thermographic temperature measurement

Abstract

The thermal conductivity distribution of the interlayer of a sandwich plate in a multidimensional heat conduction problem is obtained from the solution of the inverse heat conduction problem (IHCP) based on the thermographic temperature measurement. The modified one-dimensional correction method along with the finite volume method is employed for both two-dimensional and three-dimensional inverse problems. A series of numerical experiments are conducted in order to verify the effectiveness of the method. In addition, the effect of the temperature measurement error, the stopping criterion of the iteration, etc on the result of the problem is investigated. It is proved by numerical experiments that the method is a simple, stable and accurate one for this IHCP.

A new computational scheme on quantitative inner pipe boundary identification based on the estimation of effective thermal conductivity

“…When the measurement error is added to the temperature distribution of the inspection surface, a new test case is formed with this new simulated temperature measurement, but the precision level of the method does not change as long as the stopping criterion is the same. For further discussions one can refer to our previous study [18]. In this paper, only one example is given in figure 11 to indicate where most of the errors of the results shown in table 1 come from.…”

“…Based on Yang et al's [16] ODCM, a modified onedimensional correction method (MODCM) is presented by Fan et al [17] by correcting one error in the iteration function, modifying the obtainment of the correction terms and giving the stopping criterion of the iteration. The MODCM was applied to the identification of the inner pipe boundary [17] and also to the conductivity distribution estimation of the interlayer of a sandwich plate [18]. Better performances were shown in the numerical experiments for those inverse problems.…”

“…Then based on Taylor's series expansion, an iteration process can be derived for refining the above initial identification results of the conductivity distribution [18]:…”

Numerical Analysis of Thermodynamic Behaviour of Through-Thickness Stitched Sandwich Laminate

“…These investigations showed considerable improvement in damage tolerance and resistance to out-of-plane stress compared to conventional sandwich laminates. Experimental, analytical and numerical evaluations on thermal behaviours of sandwich plates can be found in References [21][22][23][24]. However, the studies for the thermodynamic properties of the SSL are less.…”