2007
DOI: 10.1016/j.tsf.2007.01.043
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Interplay between the deposition mode and microstructure in electrochemically deposited Cu thin films

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Cited by 19 publications
(10 citation statements)
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“…This occurred through a dissolutionnucleation process, 26 which allowed relief of microstrains through plastic deformations. 40 This is evident by the cracks visible through the catalyst films. 29 Thus, it is not surprising that no strong correlation could be drawn between the microstrains of Samples A−J and their selectivity toward ethylene formation (SI Section S5).…”
Section: Resultsmentioning
confidence: 99%
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“…This occurred through a dissolutionnucleation process, 26 which allowed relief of microstrains through plastic deformations. 40 This is evident by the cracks visible through the catalyst films. 29 Thus, it is not surprising that no strong correlation could be drawn between the microstrains of Samples A−J and their selectivity toward ethylene formation (SI Section S5).…”
Section: Resultsmentioning
confidence: 99%
“…We further note that the Cu 2 O-derived Cu films prepared in this work were formed through the in situ reduction of Cu 2 O. This occurred through a dissolution-nucleation process, which allowed relief of microstrains through plastic deformations . This is evident by the cracks visible through the catalyst films .…”
Section: Resultsmentioning
confidence: 99%
“…12 A thin electrodeposited Cu film usually exhibits a strong (111) texture because (111) planes have the lowest surface energy among the major low-indices planes. 8 With the increase of film thickness, an increasing strain energy is developed and the (110) texture is favored because (110) planes can accommodate larger strains than (111) planes. Figure 2 shows the texture coefficient ratio, TC (110) /TC (111) , against the film thickness for the DC-and PC-deposited Cu films deposited in the electrolytes with different chloride concentration.…”
Section: Resultsmentioning
confidence: 99%
“…By increasing the peak current density, a transition from (110) to (111) texture occurred due to the anisotropic growth rate of different crystallographic planes in the electrodeposited Cu films. It has also been reported that with increasing negative electrochemical potential the crystallographic texture of Cu films changed from (111) to (110) or (100) orientation, which is attributed to the competition between surface energy and strain energy of Cu crystallites …”
Section: Introductionmentioning
confidence: 95%
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