Internal stress state measurements of the large molded electronic control units

Gromala, Przemyslaw Jakub; Fischer, Sebastian; Zoller, Tobias; Andreescu, A.; Duerr, J.; Rapp, Morton S.; Wilde, Juergen

doi:10.1109/eurosime.2013.6529894

Cited by 18 publications

(3 citation statements)

References 7 publications

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“…[14]. Another method that is successfully used is stress [15] or strain [16] measurements. Some non-destructive techniques such as acoustic tomograhy [17] & active thermgraphy [18] have been employed to monitor solder fatigue.…”

Section: Introductionmentioning

confidence: 99%

Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE

Sasi

Yadur

Gromala

2015

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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The new age product development demands rolling out effective & efficient designs in short time span and reduced costs in the view of increased competition from market players. This requires the time conventionally needed for conceptualization and validation of new designs has to be significantly reduced without having to compromise on the quality. In order to determine the optimized variant, it is necessary to evaluate its thermal, thermo-mechanical, static response under varying material properties. This also helps in ascertaining the sensitive material parameters which influences the critical response. Finite element based simulation plays a crucial role here in predicting system behavior under varying parameters. This method proves to be useful in delivering credible results within a short time span thereby accelerating the design stage. Virtual Design of Experiment (Virtual DoE) is an automated simulation methodology wherein the design space is composed of the range of properties for a particular material which are available in the market. A suitable model is considered for which the range of the properties to be evaluated are defined as design space using central composite faced (CCF) plan. Numerical simulation results for the defined points in the design space are input to obtain the response surface of the considered model. The response surface such as deformation, stress, strain & strain energy helps in determining the effect of each parameter. The degree to which each parameter affects the response determines the critical material parameters of the system. From this information a judicious decision can be taken regarding the material property for the components in a timely & cost effective manner. In the present paper an example is taken up to illustrate the selection of the molding compound for simplified DPAK model. Five parameters: coefficient of thermal expansion below and above glass transition temperature (Tg), glass transition temperature, modulus of elasticity and thermal conductivity; are investigated. Using CCF DoE plan, 52 simulation legs are defmed. This covers the entire range of the molding compounds available in the market. The results of the 52 simulation cases are evaluated and later on regression analysis is conducted. Finally an Excel tool is created that is distributed among the process team and allows being used by everyone, without any prior knowledge of ANSYS or DoE software Cornerstone. The graphical representation of simulation and DoE results in the Excel tool enables them to obtain a better understanding of the implications of the varying material properties on the design.

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Section: Introductionmentioning

confidence: 99%

Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE

Sasi

Yadur

Gromala

2015

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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“…Recently, an epoxy molding compound (EMC) was adopted to replace the metal case. The EMC technology reduced the manufacturing cost significantly, yet the presence of a large amount of outer EMC increased the stresses of ECUs during transfer molding process and operations (Gromala, Fischer, Zoller, Andreescu, Duerr, Rapp & Wilde, 2013, Kim, Han, Yadur & Gromala, 2014.…”

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confidence: 99%

“…More recently, a silicon-based IForce piezoresistive stress sensor (Gromala, Fischer, Zoller, Andreescu, Duerr, Rapp & Wilde, 2013) was employed to assess the reliability of EMC-based advanced ECUs. In spite of serval advantages, most notably in-situ stress measurements during operations, the stress sensor provides only a local stress state around the sensor.…”

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confidence: 99%

Condition Monitoring of Automotive Smart Systems utilizing Piezoresistive Stress Sensor

Wu,

Han

2017

PHMAP_CONF

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It is expected that advanced electronic components and smart systems would dictate the level of innovations in nearly all industrial sectors, including but not limited to automotive and other transport/logistics solutions,production equipment, energy and other infrastructure, etc. One such component is automotive electronic control unit (ECU), which controls the electrical system or subsystems in motor vehicles. In a conventional ECU, a protective metal case is used to ensure reliability under harsh environmental conditions. Recently, an epoxy molding compound (EMC) was adopted to replace the metal case. The EMC technology reduced the manufacturing cost significantly, yet the presence of a large amount of outer EMC increased the stresses of ECUs during transfer molding process and operations (Gromala, Fischer, Zoller, Andreescu, Duerr, Rapp & Wilde, 2013, Kim, Han, Yadur & Gromala, 2014). The long-term reliability assessment of this newly adopted manufacturing technology should be conducted to make the technology a more viable alternative to various ECUs.

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In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor

Yang

Han

Prisacaru

et al. 2020

Microelectronics Reliability

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Internal stress state measurements of the large molded electronic control units

Cited by 18 publications

References 7 publications

Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE

Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE

Condition Monitoring of Automotive Smart Systems utilizing Piezoresistive Stress Sensor

In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor

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