2004
DOI: 10.1016/j.msea.2003.09.082
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Internal oxidation of Cr in Cu–Cr/Cu2O composite powder prepared by mechanical activation

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Cited by 19 publications
(11 citation statements)
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“…The heat capacities of the phases involved are listed The thermodynamic calculation was also done for the reaction (2), (3), and (4), respectively; the adiabatic temperatures for each reaction (1-4) are presented in Table 1. The estimated adiabatic temperature of the reaction (3,4) drops significantly by adding extra Cu powder for the heat sink effect of the inert element (Cu). Moreover, reducing the chance of direct contact for the reactants by the addition of Cu powders would give a rise to the delay of incubation time (t ig ).…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The heat capacities of the phases involved are listed The thermodynamic calculation was also done for the reaction (2), (3), and (4), respectively; the adiabatic temperatures for each reaction (1-4) are presented in Table 1. The estimated adiabatic temperature of the reaction (3,4) drops significantly by adding extra Cu powder for the heat sink effect of the inert element (Cu). Moreover, reducing the chance of direct contact for the reactants by the addition of Cu powders would give a rise to the delay of incubation time (t ig ).…”
Section: Resultsmentioning
confidence: 99%
“…As suggested by Groza in early 1990's [2], the prime candidates for the most stable oxide dispersoids are considered by their large negative heats of the formation and the high melting points. There are many reports on the ODS Cu with Al 2 O 3 and Y 2 O 3 dispersoids, whereas a limited number of published papers are found on ODS Cu with Cr 2 O 3 [4,5].…”
Section: Introductionmentioning
confidence: 99%
“…This comes from the consideration of the Tresca yield criterion [12] which states that plastic deformation of the matrix will occur if the operative reduced shear stress exceeds the matrix yield stress, i.e. when: js r À s u j > 2k ¼ s y (8) For the MgO/Cu composite, only at temperature over certain values the stresses induced at interface are higher than the copper yield stress, i.e. 60 Mpa.…”
Section: Influence Of Mgo Volume Fraction On Cte Of the Mgo/cu Compositementioning
confidence: 99%
“…These characteristics make copper-matrix composites popular for a wide range of applications in electronic packaging or manufacturing of electrodes and contact terminals [1][2][3][4][5][6]. Copper can be dispersion strengthened by various dispersed particles such as oxides, carbides, and borides [7][8][9]. The wide selection of reinforcements permits the development of copper-matrix composite with low coefficient of thermal expansion (CTE) along with the increase in elastic modulus and thermal conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the residual Cr almost has no harm on the electrical conductivity of the composite [10]. Another important remembrancer is that the rate of reaction may be improved after mechanical activation [11].…”
Section: Introductionmentioning
confidence: 99%