Internal modification for cutting transparent glass using femtosecond Bessel beams

Tsai, Wu Jung; Gu, Chunhua; Cheng, Chung-Wei; Horng, Ji Bin

doi:10.1117/1.oe.53.5.051503

Cited by 35 publications

(13 citation statements)

References 18 publications

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“…It offers the possibility for direct microchannel drilling 10,28 and ultrahigh precision cutting of transparent dielectrics. 29,30 In silicon, the material response is drastically different. We note that we have enough energy density for surface damage.…”

Section: B Comparison To Silicon Materials Responsementioning

confidence: 99%

Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared

Grojo

Mouskeftaras

Delaporte

et al. 2015

Journal of Applied Physics

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We produce and characterize high-angle femtosecond Bessel beams at 1300-nm wavelength leading to nonlinearly ionized plasma micro-channels in both glass and silicon. With microjoule pulse energy, we demonstrate controlled through-modifications in 150-lm glass substrates. In silicon, strong two-photon absorption leads to larger damages at the front surface but also a clamping of the intensity inside the bulk at a level of %4 Â 10 11 W cm À2 which is below the threshold for volume and rear surface modification. We show that the intensity clamping is associated with a strong degradation of the Bessel-like profile. The observations highlight that the inherent limitation to ultrafast energy deposition inside semiconductors with Gaussian focusing [Mouskeftaras et al., Appl. Phys. Lett. 105, 191103 (2014)] applies also for high-angle Bessel beams. V C 2015 AIP Publishing LLC. [http://dx

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Section: B Comparison To Silicon Materials Responsementioning

confidence: 99%

Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared

Grojo

Mouskeftaras

Delaporte

et al. 2015

Journal of Applied Physics

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“…This does not allow full exploitation of the three-dimensional capabilities of ultrafast laser micromachining. To overcome the limitations, an application of non-diffractive Bessel beams for laser material processing has been attempted [105][106][107][108][109][110][111][112][113][114]. The intensity maximum is strongly localized over a distance that exceeds the Rayleigh range of Gaussian beams by orders of magnitudes.…”

Section: Bessel Beam Writingmentioning

confidence: 98%

“…In glass, modifications or damage tracks are found to be over longer distances [106]. The applications include the surface ablation [107,108], channel formation [109,110], writing waveguides [111] and gratings [112] within bulk glasses, and cutting of glass [113]. …”

Section: Bessel Beam Writingmentioning

confidence: 99%

[INVITED] Ultrafast laser micro-processing of transparent material

Watanabe

Itoh

2016

Optics & Laser Technology

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“…Moreover, many studies have explored multifocal laser processing, mainly using a combination of diffractive optical elements (i.e., Fresnel lens) and Bessel beams [22,23]. Tsai et al [28] demonstrated the cutting of a thin glass with a thickness of 100 µm through modification in the bulk volume, using a femtosecond laser Bessel beam and applying a breaking stress. A smooth cut edge with chipping <1 µm was obtained.…”

Section: Introductionmentioning

confidence: 99%

One-Step Femtosecond Laser Stealth Dicing of Quartz

2020

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We report on a one-step method for cutting 250-µm-thick quartz plates using highly focused ultrashort laser pulses with a duration of 200 fs and a wavelength of 1030 nm. We show that the repetition rate, the scan speed, the pulse overlap and the pulse energy directly influence the cutting process and quality. Therefore, a suitable choice of these parameters was necessary to get single-pass stealth dicing with neat and flat cut edges. The mechanism behind the stealth dicing process was ascribed to tensile stresses generated by the relaxation of the compressive stresses originated in the laser beam focal volume during irradiation in the bulk material. Such stresses produced micro-fractures whose controlled propagation along the laser beam path led to cutting of the samples.

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Internal modification for cutting transparent glass using femtosecond Bessel beams

Cited by 35 publications

References 18 publications

Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared

Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared

[INVITED] Ultrafast laser micro-processing of transparent material

One-Step Femtosecond Laser Stealth Dicing of Quartz

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