Intermetallics formation and evolution in pure indium joint for cryogenic application

Focused Ion Beam Preparation of Low Melting Point Metals: Lessons Learned From Indium

“…These types of artifacts have been observed previously (de Morais et al, 2014). There have been numerous published studied of In bumps where FIB has been utilized to characterize the bump microstructure and these papers do not recognize the possibility of artifacts during FIB sample preparation (Cheng et al, 2009;Tian et al, 2009aTian et al, , 2009bTian et al, , 2014Dang et al, 2012;Lin et al, 2020).…”

“…Since device reliability is impacted by the metallurgy of the In bumps, it is extremely important to understand the microstructure of the In bonds and the extent of intermetallic formation within these bonds related to elevated temperature processing. Conventional metallographic techniques may be used to prepare cross-sections of the bump bonds, but it is difficult to target specific sites using this method as In or solder bumps tend to be soft, presenting difficulties in polishing and production of artifact-free cross-sections (Dasarathy, 1970;Vander Voort et al, 2004;Cheng et al, 2009;Tian et al, 2014;Lin et al, 2020).…”

“…Ga + focused ion beam (FIB) tools have been applied with some success to the preparation of cross-sections of low melting point metals (Tu & Zeng, 2002;Deppisch et al, 2006;Cheng et al, 2009;Tian et al, 2009aTian et al, , 2014Dang et al, 2012;Matsushima et al, 2013;Chou & Williams, 2014;de Morais et al, 2014;Soussan et al, 2015;Wang & Kao, 2019). There have not been any reports of the use of Xe + plasma focused ion beam (PFIB) applications to low melting point metal sample preparation.…”